Composite films of copper/boron nitride and nickel/boron nitride

The formation and characterization of composite films of copper/boron nitride (Cu/BN) and nickel/boron nitride (Ni/BN) are described. Composite Cu/BN and Ni/BN films were synthesized by a metal electrodeposition from suspensions of boron nitride particles on carbon steel substrates. The effects of concentration of boron nitride in the solution, temperature, potential and various additives on the morphology of composite films have been investigated. The morphology of these films was examined using Scanning Electron Microscopy. The elemental analysis for boron, nitrogen, copper and nickel was performed using Energy Dispersive X-ray Spectroscopy (EDS), and a Microprobe X-ray Analyzer. The Vickers hardness of Cu/BN and Ni/BN films prepared under different conditions was also investigated. It has been found that the composite Cu/BN and Ni/BN films have an increased microhardness as compared to the respective pure metal films. The effects of deposition potential, temperature, concentration of BN and presence of various additives on the microhardness of Cu/BN and Ni/BN films have been investigated.