Top-coats for scalable Nano-manufacturing with High-χ Block Copolymers in Lithographic Applications

被引:0
作者
Chevalier, Xavier [1 ]
Correia, Cindy Gomez [2 ]
Pound-Lana, Gwenaelle [3 ]
Bezard, Philippe [3 ,4 ]
Serege, Matthieu [3 ]
Petit-Etienne, Camille [3 ]
Gay, Guillaume [3 ]
Cunge, Gilles [3 ]
Cabannes-Boue, Benjamin [2 ]
Nicolet, Celia [1 ]
Navarro, Christophe [1 ]
Cayrefourcq, Ian [1 ,5 ]
Mueller, Marcus [6 ]
Hadziioannou, Georges [2 ]
Iliopoulos, Ilias [7 ]
Fleury, Guillaume [2 ]
Zelsmann, Marc [3 ]
机构
[1] GRL, ARKEMA FRANCE, Route Natl 117,BP34, F-64170 Lacq, France
[2] Univ Bordeaux, CNRS, Bordeaux INP, LCPO,UMR 5629, F-33600 Pessac, France
[3] Univ Grenoble Alpes, CNRS, CEA LETI Minatec, Grenoble INP,LTM, F-38000 Grenoble, France
[4] IMEC, Kapeldreef 75, B-3001 Leuven, Belgium
[5] I TEN SA, 12 Chemin Jubin, F-69570 Dardilly, France
[6] Georg August Univ Gottingen, Inst Theoret Phys, D-37077 Gottingen, Germany
[7] HESAM Univ, Arts & Metiers Inst Technol, CNRS, Lab PIMM,Cnam, 151 Blvd Hop, F-75013 Paris, France
来源
ADVANCES IN PATTERNING MATERIALS AND PROCESSES XXXVIII | 2021年 / 11612卷
关键词
D O I
10.1117/12.2583717
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Results for the self-assembly of lamellar silicon-containing high-chi block copolymers (BCP) with innovative neutral top-coat design are presented. We demonstrate that these materials and associated processes are compatible with a standard lithographic process, and oriented toward a potential high volume manufacturing. We show that this dedicated technology is able to guarantee the stability and planarity of the stack even at elevated self-assembly bake temperatures, and opens new opportunity in the fields of 3D BCPs stacks. Finally, we show interesting results for the etch-transfer of a lamellar BCP in silicon.
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页数:8
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