Migration of dislocations in 4H-SiC epilayers during the ion implantation process

被引:15
作者
Tsuchida, H. [1 ]
Kamata, I. [1 ]
Nagano, M. [1 ]
Storasta, L. [1 ]
Miyanagi, T. [1 ]
机构
[1] CRIEPI, 2-6-1 Nagasaka, Kanagawa 2400196, Japan
来源
SILICON CARBIDE AND RELATED MATERIALS 2006 | 2007年 / 556-557卷
关键词
epitaxy; X-ray topography; ion implantation; basal plane dislocation;
D O I
10.4028/www.scientific.net/MSF.556-557.271
中图分类号
TQ174 [陶瓷工业]; TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
Synchrotron reflection X-ray topography and KOH etching were applied to investigate the effects of the ion implantation/annealing process on the existing dislocations in the 4H-SiC epilayers and second epitaxial growth on the ion implanted layer. No systematic generation of dislocations or stacking faults caused by the second epitaxial growth on the implanted layer was observed, while BPDs were confirmed to migrate in the epilayer during the implantation/annealing process. The BPDs bend markedly near the bottom of the implanted layer and tend to lie along the < 1-100 > (perpendicular to the off-cut direction) after the imp lantation/annealing process. The lattice mismatch strain created by the implantation is a possible driving force of the glide motion of the BPDs.
引用
收藏
页码:271 / +
页数:2
相关论文
共 11 条
[1]   NATURE, ORIGIN AND EFFECT OF DISLOCATIONS IN EPITAXIAL SEMICONDUCTOR LAYERS [J].
BOOKER, GR ;
TITCHMARSH, JM ;
FLETCHER, J ;
DARBY, DB ;
HOCKLY, M ;
ALJASSIM, M .
JOURNAL OF CRYSTAL GROWTH, 1978, 45 (01) :407-425
[2]   Forward-bias degradation in 4H-SiC p+nn+ diodes:: Influence of the mesa etching [J].
Camara, N ;
Thuaire, A ;
Bano, E ;
Zekentes, K .
SILICON CARBIDE AND RELATED MATERIALS 2004, 2005, 483 :773-776
[3]   Process and Device Simulation of a SiC Floating Junction Schottky Barrier Diode (Super-SBD) [J].
Hatakeyama, T ;
Nishio, J ;
Shinohe, T .
SILICON CARBIDE AND RELATED MATERIALS 2004, 2005, 483 :921-924
[4]   SiC hornoepitaxy on Al-ion-implanted layers for fabricating power device structures [J].
Imaizumi, M ;
Tanimura, J ;
Tarui, Y ;
Sugimoto, H ;
Ohtsuka, K ;
Takami, T ;
Ozeki, T .
JOURNAL OF CRYSTAL GROWTH, 2002, 237 :1219-1223
[5]   Long term operation of 4.5kV PiN and 2.5kV JBS diodes [J].
Lendenmann, H ;
Dahlquist, F ;
Johansson, N ;
Söderholm, R ;
Nilsson, PA ;
Bergman, JP ;
Skytt, P .
SILICON CARBIDE AND RELATED MATERIALS, ECSCRM2000, 2001, 353-356 :727-730
[6]   Stacking fault nucleation sites in diffused 4H-SiC p-i-n diodes. -: art. no. 074501 [J].
Maximenko, SI ;
Sudarshan, TS .
JOURNAL OF APPLIED PHYSICS, 2005, 97 (07)
[7]   Investigation of the electrical activity of partial dislocations in SiC p-i-n diodes -: art. no. 033503 [J].
Maximenko, SI ;
Pirouz, P ;
Sudarshan, TS .
APPLIED PHYSICS LETTERS, 2005, 87 (03)
[8]   Annealing effects on single Shockley faults in 4H-SiC [J].
Miyanagi, Toshiyuki ;
Tsuchida, Hidekazu ;
Kamata, Isaho ;
Nakamura, Tomonori ;
Nakayama, Koji ;
Ishii, Ryousuke ;
Sugawara, Yoshitaka .
APPLIED PHYSICS LETTERS, 2006, 89 (06)
[9]   Direct observation of dislocations propagated from 4H-SiC substrate to epitaxial layer by X-ray topography [J].
Ohno, T ;
Yamaguchi, H ;
Kuroda, S ;
Kojima, K ;
Suzuki, T ;
Arai, K .
JOURNAL OF CRYSTAL GROWTH, 2004, 260 (1-2) :209-216
[10]   Difference of secondary defect formation by high energy B+ and Al+ implantation into 4H-SiC [J].
Ohno, T ;
Kobayashi, N .
JOURNAL OF APPLIED PHYSICS, 2002, 91 (07) :4136-4142