Corrosion of copper in acid-sulfate plating baths with additives

被引：0

作者：

Hua, D

Barkey, D ^{[1
]}

机构：

[1] Univ New Hampshire, Dept Chem Engn, Durham, NH 03824 USA

[2] Univ New Hampshire, Dept Math, Durham, NH 03824 USA

来源：

PLATING AND SURFACE FINISHING | 2003年 / 90卷 / 07期

关键词：

D O I：

暂无

中图分类号：

TF [冶金工业];

学科分类号：

0806 ;

摘要：

Acid copper plating baths exposed to air present a corrosive environment for copper. With feature sizes in some plating applications falling well below the micrometer scale, dissolution of metal at open circuit potential may become a consideration in process design. This paper presents a reaction-zone model of the corrosion process that can be used to estimate corrosion rates based on process parameters and open-circuit potential measurements. Corrosion of copper in acid-sulfate plating baths with additives chloride, benzotriazole and his (3-sulfopropyl) disulfide is examined experimentally with the aid of the model.

引用

页码：40 / 44

页数：5

共 13 条

[1]

ARAPKOSKE SK, 1988, UCRL20510 DEP CHEM E

[2] A reaction-plane model for the open-circuit potential of copper in aerated copper sulfate solution [J].