THE ROLE OF COMPLEMENTARY POTENTIAL IN PLASMA NITRIDING PROCESSES OF TECHNICAL TITANIUM

被引：2

作者：

Pilarska, M. ^{[1
]}

Fraczek, T. ^{[1
]}

Mazniak, K. ^{[1
]}

机构：

[1] Czestochowa Tech Univ, Fac Prod Engn & Mat Technol, 19 Armii Krajowej, PL-42200 Czestochowa, Poland

来源：

ARCHIVES OF METALLURGY AND MATERIALS | 2018年 / 63卷 / 04期

关键词：

plasma nitriding; active screen; titanium; ion nitriding; WEAR-RESISTANCE;

D O I：

10.24425/amm.2018.125087

中图分类号：

TF [冶金工业];

学科分类号：

0806 ;

摘要：

This article deals with the testing of surface layers produced on technical titanium Ti99.2 under glow discharge conditions. In order to determine the effect of process temperature on the produced surface layers, nitriding processes were carried out at 700 degrees C and 800 degrees C and for 3 and 5 hours. The research results on evaluating the properties of the obtained surface layers and the characterization of their morphology were presented. The impact of the adopted nitriding process variant on the quality of the obtained layers was evaluated. It was demonstrated that the use of the supplementary potential during the ion nitriding process reduces the unwanted edge effect, which results in a significant increase in the homogeneity of the nitrided layers and improves the functional properties of the technical titanium Ti99.2.

引用

页码：1637 / 1642

页数：6

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