In this work, PA6/PA66/GNP thermal composites were prepared via a melt blending method. Mechanical properties, morphology and thermal properties of PA6/PA66/GNP composites were investigated. The thermal conductivity of composite containing 50 wt-% of graphene nanoplatelets was measured as 5.03 W m(-1) K-1 at 30 degrees C. When the Al2O3 was replaced for graphene nanoplatelets, the thermal conductivity of composites decreased, but the mechanical properties improved. The optimum amount of Al2O3 which replaced graphene nanoplatelets is 10%. When graphite was used to replace for graphene nanoplatelets, thermal conductivity basically remained unchanged but mechanical properties decreased.
机构:
Columbia Univ, Dept Phys, New York, NY 10027 USAColumbia Univ, Dept Phys, New York, NY 10027 USA
Bolotin, K. I.
Sikes, K. J.
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Columbia Univ, Dept Appl Phys, New York, NY 10027 USAColumbia Univ, Dept Phys, New York, NY 10027 USA
Sikes, K. J.
Jiang, Z.
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Columbia Univ, Dept Phys, New York, NY 10027 USA
Natl High Magnet Field Lab, Tallahassee, FL 32310 USAColumbia Univ, Dept Phys, New York, NY 10027 USA
Jiang, Z.
Klima, M.
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Columbia Univ, Dept Mech Engn, New York, NY 10027 USAColumbia Univ, Dept Phys, New York, NY 10027 USA
Klima, M.
Fudenberg, G.
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Columbia Univ, Dept Phys, New York, NY 10027 USAColumbia Univ, Dept Phys, New York, NY 10027 USA
Fudenberg, G.
Hone, J.
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Columbia Univ, Dept Mech Engn, New York, NY 10027 USAColumbia Univ, Dept Phys, New York, NY 10027 USA
Hone, J.
Kim, P.
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Columbia Univ, Dept Phys, New York, NY 10027 USAColumbia Univ, Dept Phys, New York, NY 10027 USA
Kim, P.
Stormer, H. L.
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机构:
Columbia Univ, Dept Phys, New York, NY 10027 USA
Columbia Univ, Dept Appl Phys, New York, NY 10027 USA
Alcatel Lucent Technol, Bell Labs, Murray Hill, NJ 07974 USAColumbia Univ, Dept Phys, New York, NY 10027 USA
机构:
Columbia Univ, Dept Mech Engn, New York, NY 10027 USA
Columbia Univ, Def Adv Res Projects Agcy Ctr Integrated Micro Na, New York, NY 10027 USAColumbia Univ, Dept Mech Engn, New York, NY 10027 USA
Lee, Changgu
Wei, Xiaoding
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Columbia Univ, Dept Mech Engn, New York, NY 10027 USAColumbia Univ, Dept Mech Engn, New York, NY 10027 USA
Wei, Xiaoding
Kysar, Jeffrey W.
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Columbia Univ, Dept Mech Engn, New York, NY 10027 USA
Columbia Univ, Ctr Nanostruct Mat, New York, NY 10027 USAColumbia Univ, Dept Mech Engn, New York, NY 10027 USA
机构:
Columbia Univ, Dept Phys, New York, NY 10027 USAColumbia Univ, Dept Phys, New York, NY 10027 USA
Bolotin, K. I.
Sikes, K. J.
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h-index: 0
机构:
Columbia Univ, Dept Appl Phys, New York, NY 10027 USAColumbia Univ, Dept Phys, New York, NY 10027 USA
Sikes, K. J.
Jiang, Z.
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h-index: 0
机构:
Columbia Univ, Dept Phys, New York, NY 10027 USA
Natl High Magnet Field Lab, Tallahassee, FL 32310 USAColumbia Univ, Dept Phys, New York, NY 10027 USA
Jiang, Z.
Klima, M.
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h-index: 0
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Columbia Univ, Dept Mech Engn, New York, NY 10027 USAColumbia Univ, Dept Phys, New York, NY 10027 USA
Klima, M.
Fudenberg, G.
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h-index: 0
机构:
Columbia Univ, Dept Phys, New York, NY 10027 USAColumbia Univ, Dept Phys, New York, NY 10027 USA
Fudenberg, G.
Hone, J.
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h-index: 0
机构:
Columbia Univ, Dept Mech Engn, New York, NY 10027 USAColumbia Univ, Dept Phys, New York, NY 10027 USA
Hone, J.
Kim, P.
论文数: 0引用数: 0
h-index: 0
机构:
Columbia Univ, Dept Phys, New York, NY 10027 USAColumbia Univ, Dept Phys, New York, NY 10027 USA
Kim, P.
Stormer, H. L.
论文数: 0引用数: 0
h-index: 0
机构:
Columbia Univ, Dept Phys, New York, NY 10027 USA
Columbia Univ, Dept Appl Phys, New York, NY 10027 USA
Alcatel Lucent Technol, Bell Labs, Murray Hill, NJ 07974 USAColumbia Univ, Dept Phys, New York, NY 10027 USA
机构:
Columbia Univ, Dept Mech Engn, New York, NY 10027 USA
Columbia Univ, Def Adv Res Projects Agcy Ctr Integrated Micro Na, New York, NY 10027 USAColumbia Univ, Dept Mech Engn, New York, NY 10027 USA
Lee, Changgu
Wei, Xiaoding
论文数: 0引用数: 0
h-index: 0
机构:
Columbia Univ, Dept Mech Engn, New York, NY 10027 USAColumbia Univ, Dept Mech Engn, New York, NY 10027 USA
Wei, Xiaoding
Kysar, Jeffrey W.
论文数: 0引用数: 0
h-index: 0
机构:
Columbia Univ, Dept Mech Engn, New York, NY 10027 USA
Columbia Univ, Ctr Nanostruct Mat, New York, NY 10027 USAColumbia Univ, Dept Mech Engn, New York, NY 10027 USA