Studies on polishing of Ti and Ag-Pd-Cu-Au alloy with five dental abrasives

被引:19
作者
Hirata, T
Nakamura, T
Takashima, F
Maruyama, T
Taira, M
Takahashi, J
机构
[1] Osaka Univ, Fac Dent, Dept Fixed Prosthodont, Osaka, Japan
[2] Osaka Univ, Fac Dent, Dept Dent Mat Sci & Technol, Osaka, Japan
关键词
dental abrasives; polishing; titanium; Ag-Pd-Cu-Au alloy;
D O I
10.1046/j.1365-2842.2001.00737.x
中图分类号
R78 [口腔科学];
学科分类号
1003 ;
摘要
Titanium (Ti) and Ag-Pd-Cu-Au alloy were examined for their polishing behaviour by conducting manually controlled polishing tests using five dental abrasives [carborundum point (CR) and silicone points (R1 and R2)] driven by a high torque micromotor with rotational speeds ranging from 2000 to 15 000 r.p.m. Polishing of Ti resulted in less volume of removal upon polishing, a rougher surface and larger loss of abrasives, compared with polishing of Ag-Pd-Cu-Au alloy. Polishing of Ti with a rotational speed of 15 000 r.p.m. led to the largest volume of removal upon polishing, whilst that of 10 000 r.p.m. produced the optimal volume for Ag-Pd-Cu-Au alloy. It was concluded that Ti was much more difficult to polish, requiring special care (e.g. frequent exchange of abrasives). Development of new abrasives for polishing Ti is required.
引用
收藏
页码:773 / 777
页数:5
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