Preparation and near zero thermal expansion property of Mn3Cu0.5A0.5N (A = Ni, Sn)/Cu composites

被引：57

作者：

Ding, Lei ^{[1
]}

Wang, Cong ^{[1
]}

Na, Yuanyuan ^{[1
]}

Chu, Lihua ^{[1
]}

Yan, Jun ^{[1
]}

机构：

[1] Beihang Univ, Minist Educ, Key Lab Micronano Measurement Manipulat & Phys, Ctr Condensed Matter & Mat Phys,Dept Phys, Beijing 100191, Peoples R China

来源：

SCRIPTA MATERIALIA | 2011年 / 65卷 / 08期

基金：

中国国家自然科学基金;

关键词：

Mn3XN/Cu; Composites; Near zero thermal expansion; Room temperature; COEFFICIENT;

D O I：

10.1016/j.scriptamat.2011.07.008

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

In this work, Mn(3)Cu(0.5)A(0.5)N (A = Ni, Sn)/Cu composites with near zero thermal expansion property were successfully synthesized. It was found that the large positive thermal expansion of Cu can be effectively suppressed in the composite with the antiperovskite Mn(3)Cu(0.5)A(0.5)N (A = Ni, Sn). In particular, the composites show almost zero thermal expansion with a coefficient of thermal expansion of 4.7 x 10(-7) K-1 in the temperature range 290-320 K. We suggest that this offers a new alternative for metal matrix composites with low and near zero thermal expansion properties. (C) 2011 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.

引用

页码：687 / 690

页数：4

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