Flip chip microassembly of a silicon triaxial force sensor on flexible substrates

被引：14

作者：

Sieber, Ame ^{[1
]}

Valdastri, Pietro ^{[2
]}

Houston, Keith ^{[2
]}

Menciassi, Arianna ^{[2
]}

Dario, Paolo ^{[2
]}

机构：

[1] ARC Seibersdorf Res GmbH, Seibersdorf, Austria

[2] Scuola Super Sant Anna, Polo St Anna Valdera, CRIM Lab, Pisa, Italy

来源：

SENSORS AND ACTUATORS A-PHYSICAL | 2008年 / 142卷 / 01期

关键词：

MEMS; microassembly; anisotropic film; bonding; flip chip;

D O I：

10.1016/j.sna.2007.02.042

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Miniaturization of microelectromechanical systems (MEMS) based devices can be achieved by flip chip assembly directly onto a flexible circuit substrate. The main goal of this work was the selection of a suitable bonding material and process to enable scaling down of MEMS sensorized devices for biomedical applications. Finally, the heat bondable anisotropic conductive film 5552R (3M) allowed mechanical robust and low resistance electrical bondings together with a short process cycle time. (c) 2007 Elsevier B.V. All rights reserved.

引用

页码：421 / 428

页数：8

共 7 条

[1] Design and fabrication of a hybrid silicon three-axial force sensor for biomechanical applications
Beccai, L
Roccella, S
Arena, A
Valvo, F
Valdastri, P
Menciassi, A
Carrozza, MC
Dario, P
[J]. SENSORS AND ACTUATORS A-PHYSICAL, 2005, 120 (02) : 370 - 382
[2] BECCAI L, 2006, ESDA C 2006 TUR IT
[3] Six-degree of freedom micro force-moment sensor for application in geophysics
Dao, DV
Toriyama, T
Wells, J
Sugiyama, S
[J]. FIFTEENTH IEEE INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS, TECHNICAL DIGEST, 2002, : 312 - 315
[4] MURRAY CT, 2000, RELIABILITY STUDY SU
[5] Characterization of a novel hybrid silicon three-axial force sensor
Valdastri, P
Roccella, S
Beccai, L
Cattin, E
Menciassi, A
Carrozza, MC
Dario, P
[J]. SENSORS AND ACTUATORS A-PHYSICAL, 2005, 123-24 : 249 - 257
[6] VALDASTRI P, 2006, ESDA C 2006 TUR IT
[7] Integration of a miniaturised triaxial force sensor in a minimally invasive surgical tool
Valdastri, Pietro
Harada, Kanako
Menciassi, Arianna
Beccai, Lucia
Stefanini, Cesare
Fujie, Masakatsu
Dario, Paolo
[J]. IEEE TRANSACTIONS ON BIOMEDICAL ENGINEERING, 2006, 53 (11) : 2397 - 2400

← 1 →