Nonoverlapping Power/Ground Planes for Suppression of Power Plane Noise

被引：1

作者：

Engin, Arif Ege ^{[1
]}

Ndip, Ivan ^{[2
]}

Lang, Klaus-Dieter ^{[3
]}

Aguirre, Gerardo ^{[4
]}

机构：

[1] San Diego State Univ, Dept Elect & Comp Engn, San Diego, CA 92182 USA

[2] Fraunhofer Inst Zuverlaessigkeit & Mikrointegrat, Dept RF & Smart Sensor Syst, D-13355 Berlin, Germany

[3] Fraunhofer Inst Zuverlaessigkeit & Mikrointegrat, D-13355 Berlin, Germany

[4] Kyocera Int Inc, San Diego, CA 92111 USA

来源：

IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY | 2018年 / 8卷 / 01期

基金：

美国国家科学基金会;

关键词：

Materials characterization; power and ground (PG) planes; power distribution network; power integrity; simultaneous switching noise; PRINTED-CIRCUIT BOARDS;

D O I：

10.1109/TCPMT.2017.2764801

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Providing low IR-drop and inductance are two major roles of power and ground (PG) planes in chip packages and boards. However, planes can also cause switching noise coupling, especially when they resonate. This is a concern for mixed-signal boards, high-speed I/Os, and electromagnetic compatibility. Discrete decoupling capacitors are ineffective to control switching noise at gigahertz frequency regime due to their inductance. To filter such high-frequency noise, a possible approach is modifying the shape of the PG planes, such as in power islands or electromagnetic bandgap structures. In this paper, we introduce the nonoverlapping PG planes design methodology for filtering of gigahertz power plane noise. Unlike existing approaches, our approach is simple and has wide bandwidth, while avoiding narrow inductive bridges that increase IR-drop.

引用

页码：50 / 56

页数：7

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