High-temperature Bi2Te3 thermoelectric generator fabricated using Cu nanoparticle paste bonding

被引：6

作者：

Chung, Seok-Hwan ^{[1
]}

Kim, Jong Tae ^{[1
]}

Kim, Hoyoung ^{[1
]}

Kim, Jeongmin ^{[1
]}

Kim, Dong Hwan ^{[1
]}

机构：

[1] Daegu Gyeongbuk Inst Sci & Technol DGIST, Div Nanotechnol, Daegu 42988, South Korea

来源：

JOURNAL OF ALLOYS AND COMPOUNDS | 2022年 / 896卷

基金：

新加坡国家研究基金会;

关键词：

Bi2Te3; Thermoelectric power generator; Copper nanoparticle; Lead-free solder; Spark plasma sintering; POWER-GENERATION; RELIABILITY; PERFORMANCE; CHALLENGES; STRENGTH; FIGURE; MERIT; JOINT; LEGS;

D O I：

10.1016/j.jallcom.2021.163060

中图分类号：

O64 [物理化学（理论化学）、化学物理学];

学科分类号：

070304 ; 081704 ;

摘要：

For the successful commercialization of Bi2Te3-based thermoelectric generator (TEG) devices, not only highly efficient TE materials, but also reliable bonding materials with high thermal stability are essential. In this study, we investigated the application of Cu nanoparticle paste (CNP) bonding for increasing the operating temperature of Bi2Te3-based TEG devices. Six-chip TEG devices were fabricated by joining surfacemetalized Bi2Te3-based TE chips and Cu electrodes by CNP bonding. The optimal bonding was achieved when spark plasma sintering was carried out at 310-320 degrees C and 15 MPa. The 6-chip Bi2Te3-based TEG devices showed a maximum output power of 50-60 mW at the hot-side temperature of 400 degrees C (Delta T= 380 degrees C) and maintained almost the same output power after five thermal cycles. The scanning electron microscopy images of the thermally cycled electrodes further confirmed the robustness of the Cu nanoparticle joints. This work provides an effective method for joining TE chips and Cu electrodes for high-temperature TEG devices. (C) 2021 Published by Elsevier B.V.

引用

页数：6

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