Resist profile modeling with compact resist model

被引:2
作者
Zuniga, Christian [1 ]
Deng, Yunfei [1 ]
Granik, Yuri [1 ]
机构
[1] Mentor Graph Corp, Wilsonville, OR 97070 USA
来源
OPTICAL MICROLITHOGRAPHY XXVIII | 2015年 / 9426卷
关键词
Resist; CAR; profile; toploss; NTD; SRAF; CM1; OPC; simulation;
D O I
10.1117/12.2086468
中图分类号
O43 [光学];
学科分类号
070207 ; 0803 ;
摘要
Resist profile shapes become important for 22nm node and beyond as the process window shrinks. Degraded profile shapes for example may induce etching failures. Rigorous resist simulators can simulate a 3D resist profile accurately but they are not fast enough for correction or verification on a full chip. Compact resist models are fast but have traditionally modeled the resist in two dimensions. They provide no information on the resist loss and sidewall angle. However, they can be extended to predict resist profiles by proper setting of optical parameters and by accounting for vertical effects. Large resist shrinkages in NTD resists can also be included in the compact model. This article shows how a compact resist model in Calibre can be used to predict resist profiles and resist contours at arbitrary heights.
引用
收藏
页数:10
相关论文
共 50 条
  • [41] Feasibility study of CARL DUV-positive resist for 30-kV electron beam application and status of further resist development
    Kirch, O
    Elian, K
    Seibold, K
    MICROELECTRONIC ENGINEERING, 2001, 57-8 : 579 - 584
  • [42] Optimization of resist parameters to improve the profile and process window of the contact pattern in advanced node
    Dong, Lisong
    Zhang, Libin
    Su, Xiaojing
    Song, Zhiyang
    Wei, Yayi
    Ye, Tianchun
    JOURNAL OF MICRO-NANOLITHOGRAPHY MEMS AND MOEMS, 2016, 15 (04):
  • [43] 3D Resist Profile Full Chip Verification and Hot Spot Disposition
    Yang, Qing
    Quek, ShyueFong
    Foong, YeeMei
    Hassmann, Jens
    Zhang, DongQing
    Leschok, Andre
    Yun, Tang
    Feng, Mu
    Baron, Stanislas
    Qiu, JianHong
    Pandey, Taksh
    Yan, Bo
    Dover, Russell
    OPTICAL MICROLITHOGRAPHY XXVI, 2013, 8683
  • [44] Modeling of the Cross-linking and the Diffusion Processes in a Negative Chemically Amplified Resist
    Kim, Sang-Kon
    Oh, Hye-Keun
    Jung, Young-Dae
    An, Ilsin
    JOURNAL OF THE KOREAN PHYSICAL SOCIETY, 2009, 55 (02) : 661 - 665
  • [45] Model-based optical proximity correction for resist reflow process
    Kim, Sang-Kon
    JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS, 2006, 45 (6B): : 5440 - 5444
  • [46] Impact of resist blur on MEF, OPC and CD control
    Brunner, T
    Fonseca, C
    Seong, N
    Burkhardt, M
    OPTICAL MICROLITHOGRAPHY XVII, PTS 1-3, 2004, 5377 : 141 - 149
  • [47] The accuracy of a calibrated PROLITH physical resist model across illumination conditions
    Biafore, John J.
    Robertson, Stewart A.
    Smith, Mark D.
    Sallee, Chris
    DESIGN FOR MANUFACTURABILITY THROUGH DESIGN-PROCESS INTEGRATION, 2007, 6521
  • [48] A physical resist shrinkage model for full-chip lithography simulations
    Liu, Peng
    Zheng, Leiwu
    Ma, Maggie
    Zhao, Qian
    Fan, Yongfa
    Zhang, Qiang
    Feng, Mu
    Guo, Xin
    Wallow, Tom
    Gronlund, Keith
    Goossens, Ronald
    Zhang, Gary
    Lu, Yenwen
    ADVANCES IN PATTERNING MATERIALS AND PROCESSES XXXIII, 2016, 9779
  • [49] Simulation and analysis for microstructure profile of optical lithography based on SU-8 thick resist
    Tang, Xionggui
    Yang, Xiaoyu
    Gao, Fuhua
    Guo, Yongkang
    MICROELECTRONIC ENGINEERING, 2007, 84 (5-8) : 1100 - 1103
  • [50] Chemical metrology on latent resist images
    van Es, Maarten
    Tamer, Selman
    Bloem, Elin
    Fillinger, Laurent
    van Zeijl, Elfi
    Maturova, Klara
    van der Donck, Jacques
    Willekers, Rob
    Chuang, Adam
    Maas, Diederik
    MICRO AND NANO ENGINEERING, 2023, 19