Microstructural effects of isothermal aging on a doped SAC solder alloy

被引：8

作者：

Benabou, Lahouari ^{[1
]}

Vivet, Laurent ^{[2
]}

Quang Bang Tao ^{[3
]}

Ngoc Hai Tran ^{[3
]}

机构：

[1] Univ Versailles St Quentin En Yvelines, LISV, 45 Ave Etats Unis, F-78035 Versailles, France

[2] Valeo GEEDS Lab, La Verriere, France

[3] Univ Danang, Univ Sci & Technol, Danang, Vietnam

来源：

INTERNATIONAL JOURNAL OF MATERIALS RESEARCH | 2018年 / 109卷 / 01期

关键词：

Lead-free solder; Aging; Creep; Brittle-to-ductile transition; Alloying elements; JOINT; NI; SB;

D O I：

10.3139/146.111578

中图分类号：

TF [冶金工业];

学科分类号：

0806 ;

摘要：

An Sn-Ag-Cu based solder alloy, including Ni, Bi and Sb additives, is investigated in this study under isothermal aging conditions. Shear creep tests are conducted on different aged solder joints with copper substrate, giving the creep resistance evolution with aging time. Microscopy analyses reveal the limited growth of the Cu-rich inter-metallic layer due to the Ni content and allow for determination of the time-dependent growth of the Sn-rich inter-metallic layer. The aged specimens also exhibit a partial dynamically recrystallized microstructure after creep deformation and a brittle-to-ductile fracture transition is found with occurrence of intergranular cracking in the joint.

引用

页码：76 / 82

页数：7

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