Reliability analysis of sintered Cu joints under power cycle condition

被引：0

作者：

Gao, Yue ^{[1
]}

Chen, Chuantong ^{[1
]}

Nagao, Shijo ^{[1
]}

Suganuma, Katsuaki ^{[1
]}

Bahman, Amir Sajjad ^{[2
]}

Lannuzzo, Francesco ^{[2
]}

机构：

[1] Osaka Univ, Inst Sci & Ind Res, Osaka, Japan

[2] Aalborg Univ, Dept Energ Technol, Aalborg, Denmark

来源：

ICEPT2019: THE 2019 20TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY | 2019年

关键词：

Power devices packaging; Sintered Cu joints; thermal shock test; Power cycle test;

D O I：

10.1109/ICEPT47577.2019.245323

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

A Cu particles paste was developed as a candidate of die attach materials for next generation power devices. The evaluation including thermal shock and power cycling test were performed on SiC-DBC die-attach structure to test the reliability of sintered Cu joints. The thermal shock reliability of SiC die-attached on a DBC substrate was carried out from -50 degrees C to 250 degrees C in the ambient atmosphere. SiC MOSFETs bonded by the Cu paste were evaluated by power cycle test from 25 degrees C to 200 degrees C. In both test condition, the sintered Cu joints showed good stability. The shear strength increased with the thermal shock cycles increased, which can be attributed to Cu oxidation during test. The power cycle test also showed no obvious deterioration occurred.

引用

页数：4

共 14 条

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