A Study on Thermal Fracture Processing Models Applied to Glass Substrate Cutting

被引：1

作者：

Huang, Kuo-Cheng ^{[1
]}

Hung, Min-Wei ^{[1
]}

Tseng, Shih-Feng ^{[1
]}

Hwang, Chi-Hung ^{[1
]}

机构：

[1] Instrument Technol Res Ctr, Natl Appl Res Labs, Hsinchu 30076, Taiwan

来源：

ADVANCES IN MATERIALS AND PROCESSING TECHNOLOGIES II, PTS 1 AND 2 | 2011年 / 264-265卷

关键词：

Thermal fracture-cutting technology; Thermal weight function; Fracture mechanics;

D O I：

10.4028/www.scientific.net/AMR.264-265.1252

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Thermal fracture-cutting technology (TFCT) for brittle materials has become the main technology for LCD glass substrate cutting to meet the low residual thermal stresses requirement. Based on the thermal weight function principle of fracture mechanics, this paper presents thermal weight function distributions for the mode-I and mode-II fracture model, and the fracture phenomenon under a variety of cutting paths, such as tilt crack, split crack, twist crack, and local buckling.

引用

页码：1252 / 1257

页数：6

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