Multi-echelon Repair Inventory Systems: Select Issues in Modular Electronic Equipment

Flow of modules/printed circuit boards (PCBs) in a multi-echelon repair inventory system pertaining to modular electronic equipment for large maintenance organisations having large inventory in range and depth, like defence has been critically examined using a case study. Desirable features of the proposed system are identified and a general framework suggested for examining its feasibility and implementation in an organisation. An analytical model with an objective to reduce number of echelons is also suggested and compared with the base model. It is suggested that various models can be compared through simulation and their performance measured using balanced scorecard approach.