Anisotropic thermal expansion of Ni3Sn4, Ag3Sn, Cu3Sn, Cu6Sn5 and βSn

被引：67

作者：

Xian, J. W. ^{[1
]}

Zeng, G. ^{[1
,2
]}

Belyakov, S. A. ^{[1
]}

Gu, Q. ^{[3
]}

Nogita, K. ^{[2
]}

Gourlay, C. M. ^{[1
]}

机构：

[1] Imperial Coll, Dept Mat, London SW7 2AZ, England

[2] Univ Queensland, Sch Mech & Min Engn, NS CMEM, Brisbane, Qld 4072, Australia

[3] Australian Synchrotron, Powder Diffract Beamline, Clayton, Vic 3168, Australia

来源：

INTERMETALLICS | 2017年 / 91卷

基金：

英国工程与自然科学研究理事会;

关键词：

Intermetallics; Anisotropy; Joining (soldering); Interfaces; Diffraction (X-ray); Electron backscatter diffraction; PHASE-STABILITY; POWDER DIFFRACTION; NISN4; FORMATION; TIN; NI; SOLIDIFICATION; BEHAVIOR; SOLDERS; TRANSFORMATIONS; MICROSTRUCTURE;

D O I：

10.1016/j.intermet.2017.08.002

中图分类号：

O64 [物理化学（理论化学）、化学物理学];

学科分类号：

070304 ; 081704 ;

摘要：

The directional coefficient of thermal expansion (CTE) of intermetallics in electronic interconnections is a key thermophysical property that is required for microstructure-level modelling of solder joint reliability. Here, CTE ellipsoids are measured for key solder intermetallics using synchrotron x-ray diffraction (XRD). The role of the crystal structure used for refinement on the CTE shape and temperature dependence is investigated. The results are used to discuss the beta Sn-IMC orientation relationships (ORs) that minimise the in-plane CTE mismatch on IMC growth facets, which are measured with electron backscatter diffraction (EBSD) in solder joints on Cu and Ni substrates. The CTE mismatch in fully-intermetallic joints is discussed, and the relationship between the directional CTE of monoclinic and hexagonal polymorphs of Cu6Sn5 is explored.

引用

页码：50 / 64

页数：15

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