Distribution and evolution of thermal stress in laser powder bed fusion: conduction mode versus keyhole mode

被引:3
作者
Chen, Changpeng [1 ]
Xiao, Zhongxu [2 ]
Xue, Gang [1 ]
Liao, Hailong [1 ]
Zhu, Haihong [2 ]
机构
[1] Huazhong Univ Sci & Technol, Wuhan Natl Lab Optoelect, Wuhan, Peoples R China
[2] Huazhong Univ Sci & Technol, Wuhan, Peoples R China
基金
中国博士后科学基金;
关键词
Residual stress; Laser powder bed fusion; Conduction mode; Keyhole mode; FINITE-ELEMENT SIMULATION; RESIDUAL-STRESS; PROCESS PARAMETERS; MELTING PROCESS; TEMPERATURE; DYNAMICS; FIELDS; SPEED;
D O I
10.1108/RPJ-03-2021-0063
中图分类号
TH [机械、仪表工业];
学科分类号
0802 ;
摘要
Purpose High temperature gradient induces high residual stress, producing an important effect on the part manufacturing during laser powder bed fusion (LPBF). The purpose of this study is to investigate the effect of the molten pool mode on the thermal stress of Ti-6Al-4V alloy during different deposition processes. Design/methodology/approach A coupled thermal-mechanical finite element model was built. The developed model was validated by comparing the numerical results with the experimental data in the maximum molten pool temperature, the molten pool dimension and the residual stress described in the previous work. Findings For the single-track process, the keyhole mode caused an increase in both the maximum stress and the high-stress area compared with the conduction mode. For the multitrack process, a lower tensile stress around the scanning track and a higher compressive stress below the scanning track were found in the keyhole mode. For the multilayer process, the stress along the scanning direction at the middle of the part changed from tensile stress to compressive stress with the increase in the deposition layer number. As the powder layer number increased, the stress along the scanning direction near the top surface of the part decreased while the stress along the deposition direction obviously increased, indicating that the stress along the deposition direction became the dominant stress. The keyhole mode can reduce the residual stress near the top of the part, and the conduction mode was more likely to produce a low residual stress near the bottom of the part. Originality/value The results provide a systematic understanding of thermal stress during the LPBF process.
引用
收藏
页码:1325 / 1345
页数:21
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