Non-Fourier heat conduction and thermal stress analysis for three-dimensional MCM substrate

In the case presented in this paper, classical Fourier heat conductive model and the Non-Fourier heat conductive model were both taken into account for the three-dimensional MCM (Multi Chip Modules) substrate. The distribution of temperature field of the 3-D substrate was obtained by using FDM (Finite Difference Method) with ADI. The simulation results of the temperature field were exerted to the finite element model as the body load to calculate thermal stress of the substrate utilizing ANSYS. The effect of Non-Fourier heat conduction and Non-Fourier thermal stresses were investigated. Based on simulation results of the temperature and stress field distribution in the substrate, we obtained the temperature and stress variation trend as a result of the effect of Non-Fourier. Compared to the classical Fourier model, when using Non-Fourier model, it was found that the temperature value is higher; the temperature field takes longer time to enter the steady state; the changing of the temperature is faster; and the phenomenon of thermal coupling is stronger. Meanwhile, it might have greater thermal stress in heat sources that dissipate greater heat, in restrained surface, and in the model border areas. The thermal analysis of MCM substrate in the past is less likely to adopt Non-Fourier model. The analysis course and method in this paper may be used to study the Non-Fourier effect in electronic packaging for reference.