Thermal stability analysis of conduction-cooled HTS coil

被引：3

作者：

Obana, T ^{[1
]}

Tasaki, K

Kuriyama, T

Okamura, T

机构：

[1] Tokyo Inst Technol, Midori Ku, Yokohama, Kanagawa 2268502, Japan

[2] Toshiba Co Ltd, Yokohama, Kanagawa 2300045, Japan

来源：

CRYOGENICS | 2003年 / 43卷 / 10-11期

关键词：

conduction-cooled HTS coil; thermal stability; thermal runaway current;

D O I：

10.1016/S0011-2275(03)00170-X

中图分类号：

O414.1 [热力学];

学科分类号：

摘要：

Thermal stability of a conduction-cooled Bi-2223/Ag pancake coil has been investigated by means of a time dependent numerical analysis. The coil is cooled by a cryocooler through a cooling plate. This study focused on the temperature profile in the coil and the thermal runaway current. It is suggested from the present analysis that not only enlarging the attached area of the cooling plate to the coil but also dispersing the cooling plate is an effective way to improve the thermal stability of a conduction-cooled HTS coil. (C) 2003 Elsevier Ltd. All rights reserved.

引用

页码：603 / 606

页数：4