共 34 条
[2]
Finite elements for thermoelectric device analysis in ANSYS
[J].
ICT: 2005 24TH INTERNATIONAL CONFERENCE ON THERMOELECTRICS,
2005,
:200-203
[5]
Bejan A., 2003, HEAT TRANSFER HDB
[7]
Uniaxial ratcheting behavior of sintered nanosilver joint for electronic packaging
[J].
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING,
2014, 591
:121-129