45° polymer-based total internal reflection coupling mirrors for fully embedded intraboard guided wave optical interconnects -: art. no. 141110

被引:44
作者
Wang, L [1 ]
Wang, XL [1 ]
Jiang, W [1 ]
Choi, JH [1 ]
Bi, H [1 ]
Chen, R [1 ]
机构
[1] Univ Texas, Dept Elect & Comp Engn, Microelect Res Ctr, Austin, TX 78758 USA
基金
美国国家科学基金会;
关键词
D O I
10.1063/1.2084331
中图分类号
O59 [应用物理学];
学科分类号
摘要
An array of 50 mu mx50 mu m polymer waveguides with 45 degrees total internal reflection (TIR) wideband coupling mirrors were fabricated by soft molding to achieve fully embedded boardlevel optoelectronic interconnects. The 45 degrees TIR coupling mirrors were formed at the ends of the waveguides to provide surface normal light coupling between waveguides and optoelectronic devices. Three-dimensional optoelectronic interconnects were replicated in one-step transfer by the soft molding technique. The measured propagation loss of the multimode waveguide was 0.16 dB/cm at 850 nm wavelength. The coupling efficiency of the silver-coated 45 degrees micromirrors buried under the top cladding was 92% with low polarization sensitivity. (C) 2005 American Institute of Physics.
引用
收藏
页码:1 / 3
页数:3
相关论文
共 12 条
[1]  
[Anonymous], 1985, HDB CHEM PHYS
[2]   Fully embedded board-level guided-wave optoelectronic interconnects [J].
Chen, RT ;
Lin, L ;
Choi, C ;
Liu, YJJ ;
Bihari, B ;
Wu, L ;
Tang, SN ;
Wickman, R ;
Picor, B ;
Hibbs-Brenner, MK ;
Bristow, J ;
Liu, YS .
PROCEEDINGS OF THE IEEE, 2000, 88 (06) :780-793
[3]   Flexible optical waveguide film fabrications and optoelectronic devices integration for fully embedded board-level optical interconnects [J].
Choi, CC ;
Lin, L ;
Liu, YJ ;
Choi, JH ;
Wang, L ;
Haas, D ;
Magera, J ;
Chen, RT .
JOURNAL OF LIGHTWAVE TECHNOLOGY, 2004, 22 (09) :2168-2176
[4]   Fabrication of ridge waveguides by UV embossing and stamping of sol-gel hybrid materials [J].
Kim, WS ;
Lee, JH ;
Shin, SY ;
Bae, BS ;
Kim, YC .
IEEE PHOTONICS TECHNOLOGY LETTERS, 2004, 16 (08) :1888-1890
[5]   Three-dimensional pattern transfer and nanolithography: modified soft molding [J].
Kim, YS ;
Park, J ;
Lee, HH .
APPLIED PHYSICS LETTERS, 2002, 81 (06) :1011-1013
[6]  
LEHNAICHER S, 2000, IEE ELECT LETT, V36, P1052
[7]   Optical I/O technology for digital VLSI [J].
Mohammed, EM ;
Thomas, TP ;
Lu, D ;
Braunisch, H ;
Towle, S ;
Barnett, BC ;
Young, IA ;
Vandentop, G .
PHOTONICS PACKAGING AND INTEGRATION IV, 2004, 5358 :60-70
[8]   Polymer optical interconnects for PCB [J].
Schröder, H ;
Bauer, J ;
Ebling, F ;
Scheel, W .
POLYTRONIC 2001, PROCEEDINGS, 2001, :337-343
[9]   MT-compatible laser-ablated interconnections for optical printed circuit boards [J].
Van Steenberge, G ;
Geerinck, P ;
Van Put, S ;
Van Koetsem, J ;
Ottevaere, H ;
Morlion, D ;
Thienpont, H ;
Van Daele, P .
JOURNAL OF LIGHTWAVE TECHNOLOGY, 2004, 22 (09) :2083-2090
[10]   Soft lithography [J].
Xia, YN ;
Whitesides, GM .
ANNUAL REVIEW OF MATERIALS SCIENCE, 1998, 28 :153-184