Statistics of electric conductance through anisotropically conductive adhesive

被引:25
作者
Fu, Y [1 ]
Willander, M
Liu, J
机构
[1] Gothenburg Univ, Dept Phys, Lab Phys Elect & Photon, Ctr Microelect, S-41296 Gothenburg, Sweden
[2] Chalmers Univ Technol, Sch Mech & Vehicle Engn, Dept Prod Technol, Div Elect Prod, S-41296 Gothenburg, Sweden
来源
IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES | 2001年 / 24卷 / 02期
关键词
anisotropically conductive adhesive; constriction resistance; electric conductance;
D O I
10.1109/6144.926390
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
We have investigated the electric conductance between two contacts electrically interconnected by an anisotropically conductive adhesive (ACA). It is first demonstrated that as compared nifh the symmetric equipotential profile of a point contact between two half infinitely large conducting materials, the spatial distribution of the equipotential profile becomes deformed when the contact is close to the edge of the; conducting material. The electric potentials of two contacts also redistribute when the two contacts are brought together in nearby vicinity. By simulating the metal fillers' spatial distributions in an ACA, me have shown that the spatial uniformity of the electric conduction between two contacts depends on the number of metal particles that interconnect the two contacts. Increasing the number of metal fillers on the contact pad improves the uniformity of the electric conduction. It however also increases the constriction resistances due to fellow particles so that the total conductance does not increase in the additive manner.
引用
收藏
页码:250 / 255
页数:6
相关论文
共 15 条
[1]  
BASAVANHALLY NR, 1992, P ELECTR C, P487, DOI 10.1109/ECTC.1992.204250
[2]  
Chang D. D., 1992, Proceedings of the Technical Program. NEPCON West '92, P1381
[3]   AN OVERVIEW AND EVALUATION OF ANISOTROPICALLY CONDUCTIVE ADHESIVE FILMS FOR FINE-PITCH ELECTRONIC ASSEMBLY [J].
CHANG, DD ;
CRAWFORD, PA ;
FULTON, JA ;
MCBRIDE, R ;
SCHMIDT, MB ;
SINITSKI, RE ;
WONG, CP .
IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1993, 16 (08) :828-835
[4]  
Fu Y, 2000, IEEE TRANS ADV PACK, V23, P15, DOI 10.1109/6040.826757
[5]   Conduction modelling of a conductive adhesive with bimodal distribution of conducting element [J].
Fu, Y ;
Liu, J ;
Willander, M .
INTERNATIONAL JOURNAL OF ADHESION AND ADHESIVES, 1999, 19 (04) :281-286
[6]   CONSTRICTION RESISTANCE AND REAL AREA OF CONTACT [J].
Greenwood, JA .
BRITISH JOURNAL OF APPLIED PHYSICS, 1966, 17 (12) :1621-+
[7]  
Holm R., 1967, Electric Contacts: Theory and Applications, DOI DOI 10.1007/978-3-662-06688-1
[8]   Electro-thermo-mechanical responses of conductive adhesive materials [J].
Hu, KX ;
Yeh, CP ;
Wyatt, KW .
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART A, 1997, 20 (04) :470-477
[9]  
Liu J, 1999, CONDUCTIVE ADHESIVES
[10]  
LIU J, 1995, P TECH PROG SMI, P102