Indium-Gallium-Zinc Oxide Schottky Diodes Operating across the Glass Transition of Stimuli-Responsive Polymers

被引:13
作者
Guerrero, Edgar [1 ]
Polednik, Alexander [1 ]
Ecker, Melanie [2 ,3 ]
Joshi-Imre, Alexandra [2 ]
Choi, Wooyeol [4 ]
Gutierrez-Heredia, Gerardo [5 ]
Voit, Walter E. [1 ]
Maeng, Jimin [2 ]
机构
[1] Univ Texas Dallas, Dept Mat Sci & Engn, Richardson, TX 75080 USA
[2] Univ Texas Dallas, Dept Bioengn, Richardson, TX 75080 USA
[3] Univ North Texas, Dept Biomed Engn, UNT Discovery Pk, Denton, TX 76207 USA
[4] Oklahoma State Univ, Dept Elect Engn, Stillwater, OK 74078 USA
[5] Ctr Invest Opt Leon, Guanajuato 37150, Mexico
关键词
indium-gallium-zinc oxide; IGZO; Schottky diodes; soft electronics; softening polymers; stimuli responsive materials; TRANSISTORS;
D O I
10.1002/aelm.201901210
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
Implementing stable electronic components on smart, soft materials can facilitate increasingly complex functionality in body-worn and implanted devices for biomedical applications. The fabrication and characterization of indium-gallium-zinc oxide (IGZO)-based Schottky diodes on a thiol-ene/acrylate shape memory polymer (SMP) that softens in response to physiological stimuli, including temperature and moisture, are presented. A platinum-IGZO Schottky junction is formed on the softening polymer assisted by ultraviolet-ozone (UV-O-3) surface treatment. The effects of the UV-O-3 treatment conditions on the Schottky barrier properties are examined. The diode operation is evaluated in dry and wet conditions with varying temperatures up to 75 degrees C, revealing that the fabricated diodes preserve their performance even after the softening effect (i.e., an orders-of-magnitude modulus change) is induced in the polymer substrate. Additionally, high-frequency diode operation up to 1 GHz is demonstrated for devices with an active area of 10 000 mu m(2) at 0 V bias. These devices can serve as building blocks for high-frequency rectifying circuits and in more sophisticated arrangements toward applications in, for example, wireless bioelectronic implants.
引用
收藏
页数:8
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