Comparison of Analog and Noise Performance between Buried Channel versus Surface Devices in HKMG I/O Devices

被引:4
作者
Pirro, L. [1 ]
Jayakumar, A. [1 ]
Zimmerhackl, O. [1 ]
Lipp, D. [1 ]
Illgen, R. [1 ]
Muehlhoff, A. [1 ]
Pfuetzner, R. [1 ]
Zaka, A. [1 ]
Otto, M. [1 ]
Hoentschel, J. [1 ]
Raffel, Y. [2 ]
Seidel, K. [2 ]
Olivo, R. [2 ]
机构
[1] GLOBALFOUNDRIES Fab1 LLC & Co KG, Dresden, Saxony, Germany
[2] Fraunhofer IPMS, Dresden, Saxony, Germany
来源
2021 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM (IRPS) | 2021年
关键词
LFN; flicker noise; buried-channel; RTS; intrinsic gain; DESIGN;
D O I
10.1109/IRPS46558.2021.9405122
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
In this work buried channel devices were successfully integrated in HKMG. Analog, noise and reliability performance have been reported and compared to a surface device. The devices were processed to have the same V-Tsat for the nominal geometry of a corresponding surface device. Advantages and drawbacks of the two integrations are discussed and explained with the support of calibrated TCAD simulations.
引用
收藏
页数:4
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