N-Polar InAlN/AlN/GaN MIS-HEMTs

被引:20
作者
Brown, David F. [1 ]
Nidhi [1 ]
Wu, Feng [2 ]
Keller, Stacia [1 ]
DenBaars, Steven P. [1 ,2 ]
Mishra, Umesh K. [1 ]
机构
[1] Univ Calif Santa Barbara, Dept Elect & Comp Engn, Santa Barbara, CA 93106 USA
[2] Univ Calif Santa Barbara, Dept Mat, Santa Barbara, CA 93106 USA
关键词
GaN; high-electron-mobility transistor (HEMT); InAlN; metal-insulator-semiconductor (MIS); N-face; ELECTRON-MOBILITY TRANSISTORS; FACE; GAN;
D O I
10.1109/LED.2010.2050052
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
N-polar metal-insulator-semiconductor high-electron-mobility transistors (MIS-HEMTs) were fabricated from a GaN/AlN/InAlN/GaN heterostructure grown by metalorganic chemical vapor deposition on a vicinal sapphire substrate, using Si(3)N(4) as the gate insulator. Hall measurements in van der Pauw geometry on the heterostructure showed a sheet charge density and a mobility of 2.15 x 10(13) cm(-2) and 1135 cm(2) . V(-1) . s(-1), respectively. Resistance measurements revealed anisotropic conductivity with respect to the surface steps induced by the substrate misorientation, and the sheet resistance of the 2-D electron gas was as low as 226 Omega/rectangle in the parallel direction. MIS-HEMTs with a gate length of 0.7 mu m and a source-drain spacing of 2.2 mu m had a peak drain current of 1.47 A/mm and an on-resistance of 1.45 Omega . mm. At a drain bias of 8 V, the current-and power-gain cutoff frequencies were 14 and 25 GHz, respectively.
引用
收藏
页码:800 / 802
页数:3
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