Variations in contrast of scanning electron microscope images for microstructure analysis of Si-based semiconductor materials

被引:19
作者
Itakura, Masaru [1 ]
Kuwano, Noriyuki [1 ,2 ]
Sato, Kaoru [3 ]
Tachibana, Shigeaki [4 ]
机构
[1] Kyushu Univ, Dept Appl Sci Elect & Mat, Fukuoka 8168580, Japan
[2] Kyushu Univ, Art Sci & Technol Ctr Cooperat Res, Fukuoka 8168580, Japan
[3] JFE Steel Corp, Steel Res Lab, Kanagawa 2100855, Japan
[4] SII Nano Technol Inc, Yokohama Demonstrat Lab, Kanagawa 2260006, Japan
来源
JOURNAL OF ELECTRON MICROSCOPY | 2010年 / 59卷
关键词
scanning electron microscopy; channelling contrast; semiconductor materials;
D O I
10.1093/jmicro/dfq044
中图分类号
TH742 [显微镜];
学科分类号
摘要
Image contrasts of Si-based semiconducting materials have been investigated by using the latest scanning electron microscope with various detectors under a range of experimental conditions. Under a very low accelerating voltage (500 V), we obtained a good image contrast between crystalline SiGe whiskers and the amorphous matrix using an in-lens secondary electron (SE) detector, while the conventional topographic SE image and the compositional backscattered electron (BSE) image gave no distinct contrast. By using an angular-selective BSE (AsB) detector for wide-angle scattered BSE, on the other hand, the crystal grains in amorphous matrix can be clearly visualized as 'channelling contrast'. The image contrast is very similar to that of their transmission electron microscope image. The in-lens SE (true SE is approximately equal to SE1) and the AsB (channelling) contrasts are quite useful to distinguish crystalline parts from amorphous ones.
引用
收藏
页码:S165 / S173
页数:9
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