Evaluation Method of Balance Mismatch Using CMRR Measurement for Printed Circuit Board

被引：0

作者：

Shimazaki, Mutsumi ^{[1
]}

Asai, Hideki ^{[2
]}

机构：

[1] Mitsubishi Electr Corp, Corp Prod Engn Dept, Chiyoda Ku, Tokyo 1008310, Japan

[2] Shizuoka Univ, Res Inst Elect, Hamamatsu, Shizuoka 4328561, Japan

来源：

2014 INTERNATIONAL SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY, TOKYO (EMC'14/TOKYO) | 2014年

关键词：

Balance Degree; CDF; CMRR; EMI;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

When a primary factor of common-mode noise is corresponding to mismatch of balance on the wiring, the balance degree may be obtained from CMRR (Common Mode Rejection Ratio) of the printed circuit board in the equipment. We calculated CDF(Current Division Factors) as balance degree of micro strip lines. And we showed relational expression of the balance degree and CMRR. By the CMRR measurement, the mismatch of balance between cable and substrate wiring can be evaluated quantitatively.

引用

页码：101 / 104

页数：4

共 50 条

[41] Modeling of power planes in printed circuit board using planar circuit approach
Kung, FWL
Chuah, HT
JOURNAL OF ELECTROMAGNETIC WAVES AND APPLICATIONS, 1997, 11 (09) : 1229 - 1248
[42] Evaluation of Printed Circuit Board Assembly manufacturing systems using Fuzzy Colored Petri Nets
Shiu, SCK
Tsang, ECC
Yeung, DS
Lam, MB
1998 IEEE INTERNATIONAL CONFERENCE ON SYSTEMS, MAN, AND CYBERNETICS, VOLS 1-5, 1998, : 1506 - 1511
[43] Thermal stress evaluation of printed circuit board and connector due to current flow by using holography
Taniguchi, M
Takagi, T
ITHERM '98: SIXTH INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS, 1998, : 152 - 158
[44] Manufacture and Evaluation of Light Emitting Diode Package Substrate Using Flexible Printed Circuit Board
Park, Jung-Kab
Shin, Jin-Ha
Jung, Mun-Gi
Shigehisa, Tomabechi
Park, Hwa-Sun
Suh, Su-Jeong
JOURNAL OF NANOSCIENCE AND NANOTECHNOLOGY, 2015, 15 (10) : 7578 - 7581
[45] Novel method for simultaneous formation of wires and vias of a printed circuit board using nanoporous body
Asakawa, K
Matake, S
Hotta, Y
Hiraoka, T
IEEE TRANSACTIONS ON ADVANCED PACKAGING, 2006, 29 (02): : 211 - 217
[46] Optimization of surface component mounting on the printed circuit board using SOM-TSP method
Fujimura, K
Obu-Cann, K
Tokutaka, H
NINTH INTERNATIONAL CONFERENCE ON ARTIFICIAL NEURAL NETWORKS (ICANN99), VOLS 1 AND 2, 1999, (470): : 643 - 648
[47] Comparative Study of Crosstalk Reduction Techniques in RF Printed Circuit Board Using FDTD Method
Packianathan, Rajeswari
Srinivasan, Raju
INTERNATIONAL JOURNAL OF ANTENNAS AND PROPAGATION, 2015, 2015
[48] DRY FILM PHOTORESIST APPLICATION TO A PRINTED CIRCUIT BOARD (PCB) USING A MASKLESS PHOTOLITHOGRAPHY METHOD
Suwandi, Dedi
Aziz, Rofan
Sifa, Agus
Haris, Emin
Istiyanto, Jos
Whulanza, Yudan
INTERNATIONAL JOURNAL OF TECHNOLOGY, 2019, 10 (05) : 1033 - 1041
[49] Filters with inductance cancellation using printed circuit board transformers
Neugebauer, TC
Perreault, DJ
PESC'03: 2003 IEEE 34TH ANNUAL POWER ELECTRONICS SPECIALISTS CONFERENCE, VOLS 1-4, CONFERENCE PROCEEDINGS, 2003, : 272 - 282
[50] Modeling a printed circuit board assembly line using objects
Narayanan, S
Evans, J
Bodner, D
Sreekanth, U
Govindaraj, T
McGinnis, L
Mitchell, C
SIMULATION, 2000, 75 (5-6) : 287 - 300

← 1 2 3 4 5 →