Micro-metalforming with silicon dies

被引：0

作者：

Böhm, J ^{[1
]}

Schubert, A ^{[1
]}

Otto, T ^{[1
]}

Burkhardt, T ^{[1
]}

机构：

[1] Fraunhofer Inst Werkzeugmaschinen & Umformtech, D-09126 Chemnitz, Germany

来源：

MICRO MATERIALS, PROCEEDINGS | 2000年

关键词：

micro forming; silicon die; cold embossing; superplastic embossing;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The introduction of forming technology into MEMs manufacturing demands forming dies being characterized by a high strength and hardness, a low surface roughness, and a high precision of the microgeometry to be molded. Silicon structured by lithography and etching processes meeting these requirements almost completely. For micro-metalforming silicon dies with different structural dimensions (>1 mum) have been used. The microgeometries could be molded in different materials using cold and superplastic embossing. The precision and surface quality of the formed parts correspond to the high quality of the microstructured die. Both the low surface roughness and the accurate edges of the silicon structures are nearly represented in the molded structures. However, in particular during cold embossing die wear or even die failure could be observed limiting the implementation of silicon for micro-metalforming.

引用

页码：956 / 959

页数：4