Piezothermoelastic responses of piezoelectric composite laminates with weak interfaces

Interfacial weak bonding affects piezothermoelastic responses of piezoelectric composite laminates. To simplify the complicated piezothermoelastic constitutive laws at a weak interface, three assumptions on interfacial bonding conditions are made. They are (i) the relations between the interfacial displacement jumps and the interfacial transverse stresses; (ii) the relation (electrically semi-permeable assumption) between the interfacial potential jump and the interfacial normal electric displacement; (iii) the relation between the interfacial temperature jump and the interfacial normal opening. These assumptions form a set of systematic descriptions of three-fields-coupling at a weak interface and result in a linear mathematical formulation. The piezothermoelastic solutions of cross-ply piezoelectric laminates with weak interfaces in cylindrical bending are deduced. Some benchmark numerical results are obtained, and the effects of interfacial weak bonding on the piezothermoelastic responses are discussed.