A quick electrical inspection method of solder joint quality for LED products

被引:1
作者
Zhang, Jianhua [1 ,3 ]
Que, Xiufu [1 ,3 ]
Liu, Yanan [2 ,3 ]
Chen, Weining [4 ]
Tao, Guoqiao [4 ]
Yang, Lianqiao [2 ,3 ]
机构
[1] Shanghai Univ, Sch Mech Engn & Automat, Shanghai 200072, Peoples R China
[2] Shanghai Univ, Sch Mat Sci & Engn, Shanghai 20072, Peoples R China
[3] Shanghai Univ, Minist Educ, Key Lab Adv Display & Syst Applicat, Shanghai 200072, Peoples R China
[4] Philips China Investment Co Ltd, Shanghai 200233, Peoples R China
关键词
LED; K coefficient; heating curve; quick electric test; THERMAL-RESISTANCE; IDENTIFICATION; TEMPERATURE;
D O I
10.1088/0957-0233/27/6/065005
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Solder joint qualities of light-emitting diodes (LED) lamps have a significant effect on their lifetime. Due to variations in LEDs, the product lifetime is determined by the lowest performing component of the product when multi-LEDs are used. In this paper, we propose a quick electrical inspection method of solder joint quality for LED products, which is obtained by the heating curve measurement for a short time with the forward voltage as a temperature sensitive parameter. The utility of this quick inspection method is verified by the measurement of a solder voids ratio based on the most commonly used approaches in the industry-x-ray. The proposed method is cost effective and only needs around 1-5 s for each LED, which is about one third of the x-ray. Therefore, the quick electrical test method is both meaningful and promising especially when carrying out quality tests on large quantities of solder and can be a highly recommended method to be adopted by the LED lighting industry.
引用
收藏
页数:6
相关论文
共 18 条
[1]   REMODELING THE P-N-JUNCTION [J].
DAMLJANOVIC, DD .
IEEE CIRCUITS & DEVICES, 1993, 9 (06) :35-37
[2]   TEMPERATURE-DEPENDENCE OF SPONTANEOUS PEAK WAVELENGTH IN GAAS AND GA1-XALXAS ELECTROLUMINESCENT LAYERS [J].
DYMENT, JC ;
CHENG, YC ;
SPRINGTHORPE, AJ .
JOURNAL OF APPLIED PHYSICS, 1975, 46 (04) :1739-1743
[3]   Predicting long-term lumen maintenance life of LED light sources using a particle filter-based prognostic approach [J].
Fan, Jiajie ;
Yung, Kam-Chuen ;
Pecht, Michael .
EXPERT SYSTEMS WITH APPLICATIONS, 2015, 42 (05) :2411-2420
[4]  
Huang Yuanhao, 2012, Semiconductor Technology, V37, P329, DOI 10.3969/j.issn.1003-353x.2012.05.001
[5]   Change of effective thermal resistance of LED package according to an input current level [J].
Ji, Peng Fei ;
Moon, Cheol-Hee .
SOLID-STATE ELECTRONICS, 2013, 85 :1-5
[6]   Measuring the thermal resistance of LED packages in practical circumstances [J].
Lin, Yue ;
Lu, Yijun ;
Gao, Yulin ;
Chen, Yingliang ;
Chen, Zhong .
THERMOCHIMICA ACTA, 2011, 520 (1-2) :105-109
[7]   Experimental and numerical approach on junction temperature of high-power LED [J].
Liu, Dongjing ;
Yang, Haiying ;
Yang, Ping .
MICROELECTRONICS RELIABILITY, 2014, 54 (05) :926-931
[8]   Thermal analysis of high power LED package with heat pipe heat sink [J].
Lu, Xiang-you ;
Hua, Tse-Chao ;
Wang, Yan-ping .
MICROELECTRONICS JOURNAL, 2011, 42 (11) :1257-1262
[9]  
Mashkov Petko, 2010, 2010 International Symposium on Advanced Packaging Materials: Microtech (APM), P68, DOI 10.1109/ISAPM.2010.5441381
[10]   Measuring the Thermal Resistance in Light Emitting Diodes Using a Transient Thermal Analysis Technique [J].
Natarajan, Shweta ;
Ha, Minseok ;
Graham, Samuel .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 2013, 60 (08) :2548-2555