Challenges and opportunities of MOVPE and THVPE/HVPE for nitride light emitting devices

被引:0
作者
Matsumoto, K. [1 ]
Yamaguchi, A. [1 ]
Yano, Y. [1 ]
Tokunaga, H. [2 ]
Mishima, A. [2 ]
Tomita, Y. [1 ]
Yamaoka, Y. [1 ]
Koseki, S. [1 ]
Arimura, T. [1 ]
机构
[1] Taiyo Nippon Sanso Tsukuba Labs, 10 Ohkubo, Tsukuba, Ibaraki 3002611, Japan
[2] Taiyo Nippon Sanso Tsukuba Labs, Taiyo Nippon Sanso Cse, Tsukuba, Ibaraki, Japan
来源
LIGHT-EMITTING DEVICES, MATERIALS, AND APPLICATIONS XXIV | 2020年 / 11302卷
关键词
MOVPE; HVPE; THVPE; AlGaN; MQW; LED; bulk GaN; production cost; VAPOR-PHASE EPITAXY; GROWTH; ALN;
D O I
10.1117/12.2543943
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Challenges and opportunities of MOVPE and THVPE/HVPE for nitride light emitting devices are discussed. Attempts to grow uniform and high quality epitaxial layers for both visible and UV range are presented. In order to examine the possibility of using a bulk GaN substrate, cost parity condition of GaN on GaN LED compared with LED on sapphire is presented in terms of a lumen per dollar. It is important to improve through-put of HVPE for GaN substrate manufacturing. Tri-halide VPE (THVPE) is introduced as a newly evolving technology with a high growth rate of 300 mu m/h at a high growth temperature of 1250 degrees C, which may replace HVPE for a bulk GaN substrate. Economical consideration of the comparison of HVPE and THVPE is discussed. Regarding UVC LEDs, there is an option to use a high quality AlN template on sapphire which is fabricated by 1700 degrees C annealing at nitrogen with a face to face configuration. Possible cost reduction and remaining issue are described.
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页数:8
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