Effect of Cu-doping on the morphology of ZnTe films electrodeposited from nonaqueous bath

被引:27
作者
Chaure, NB
Nair, JP
Jayakrishnan, R
Ganesan, V
Pandey, RK [1 ]
机构
[1] Bhopal Univ, Dept Phys, Bhopal 462026, India
[2] Interuniv Consortium DAE Facil, Indore 452001, Madhya Pradesh, India
关键词
electrodeposition; X-ray diffraction; atomic force microscopy;
D O I
10.1016/S0040-6090(97)01209-1
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Electrodeposition of Cu-doped ZnTe has been studied in a bath containing ZnCl2, TeCl4, KI and CuCl2 at 160 degrees C using cyclic voltammetry in the dark and under illumination. X-ray diffraction as well as scanning electron microscopy techniques have been employed to investigate the influence of deposition potential on the structure and surface morphology of the electrodeposit. It is shown that a mixed cubic as well as hexagonal ZnTe film is electrodeposited even at a potential lower than the equilibrium potential of Zn electrodeposition. Intermediate electrodeposition potential (-0.7 V to -0.75 V) favours growth of a mixed Te and ZnTe phase. Compact, globular and single phase ZnTe can be grown at -0.95 V. The atomic force microscopic examination of the ZnTe films deposited at -0.95 V indicated compact and close packed granular growth. (C) 1998 Elsevier Science S.A. All rights reserved.
引用
收藏
页码:78 / 84
页数:7
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