Polymorphic transformation mechanism of η and η′ in single crystalline Cu6Sn5

被引：40
作者：
Li, M. Y. [1 ,2 ]
Zhang, Z. H. [1 ]
Kim, J. M. [3 ]
机构：
[1] Harbin Inst Technol, State Key Lab Adv Welding & Joining, Harbin 150001, Peoples R China
[2] Harbin Inst Technol, Shenzhen Grad Sch, Shenzhen 518055, Peoples R China
[3] Jeonnam Prov Coll, Jeonnam 517802, South Korea
来源：
APPLIED PHYSICS LETTERS | 2011年 / 98卷 / 20期
基金：
新加坡国家研究基金会;
关键词：
PHASE-STABILITY; CU; SOLDERS; SN;
D O I：
10.1063/1.3590715
中图分类号：
O59 [应用物理学];
学科分类号：
摘要：
Polymorphic transformation mechanism of eta and eta' in single crystalline Cu6Sn5 has been investigated in this study. eta phase exists at room temperature in the quenched specimens and transforms to eta' phase under aging at 150 degrees C for 40 d. The nucleation and growth of eta' phase is observed by field emission scanning electron microscope and surface reconstruction of polymorphic transformation is confirmed by both x-ray diffractometer and differential scanning calorimetry analysis. The results show that the volumetric strain energy is the dominant reason for occurring polymorphic transformation rather than order-disorder transition of eta and eta' phases. (C) 2011 American Institute of Physics. [doi:10.1063/1.3590715]
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页数：3
相关论文
共 19 条
  • [1] The complex structure of the copper-tin intermetallic compounds
    Bernal, JD
    [J]. NATURE, 1928, 122 : 54 - 54
  • [2] X-RAY-DIFFRACTION AND CALORIMETRIC INVESTIGATION OF COMPOUND CU6SN5
    GANGULEE, A
    DAS, GC
    BEVER, MB
    [J]. METALLURGICAL TRANSACTIONS, 1973, 4 (09): : 2063 - 2066
  • [3] Phase stability, phase transformations, and elastic properties of Cu6Sn5:: Ab initio calculations and experimental results
    Ghosh, G
    Asta, M
    [J]. JOURNAL OF MATERIALS RESEARCH, 2005, 20 (11) : 3102 - 3117
  • [4] THE SUPERSTRUCTURE OF DOMAIN-TWINNED ETA'-CU6SN5
    LARSSON, AK
    STENBERG, L
    LIDIN, S
    [J]. ACTA CRYSTALLOGRAPHICA SECTION B-STRUCTURAL SCIENCE, 1994, 50 : 636 - 643
  • [5] CRYSTAL-STRUCTURE MODULATIONS IN ETA-CU5SN4
    LARSSON, AK
    STENBERG, L
    LIDIN, S
    [J]. ZEITSCHRIFT FUR KRISTALLOGRAPHIE, 1995, 210 (11): : 832 - 837
  • [6] Interfacial reactions between lead-free solders and common base materials
    Laurila, T
    Vuorinen, V
    Kivilahti, JK
    [J]. MATERIALS SCIENCE & ENGINEERING R-REPORTS, 2005, 49 (1-2) : 1 - 60
  • [7] First-principles calculations of structural and mechanical properties of Cu6Sn5 -: art. no. 031913
    Lee, NTS
    Tan, VBC
    Lim, KM
    [J]. APPLIED PHYSICS LETTERS, 2006, 88 (03) : 1 - 3
  • [8] Experimental investigation and thermodynamic calculation of the phase equilibria in the Cu-Sn and Cu-Sn-Mn systems
    Liu, XJ
    Wang, CP
    Ohnuma, I
    Kainuma, R
    Ishida, K
    [J]. METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE, 2004, 35A (06): : 1641 - 1654
  • [9] Cracking and phase stability in reaction layers between Sn-Cu-Ni solders and Cu substrates
    Nogita, K.
    Gourlay, C. M.
    Nishimura, T.
    [J]. JOM, 2009, 61 (06) : 45 - 51
  • [10] Prymark J., 2001, FUNDAMENTALS MICROSY
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