Development of a novel Ductile-machining system for fabricating axisymmetric aspheric surfaces on brittle materials

被引:6
作者
Yan, J
Tamaki, J
Syoji, K
Kuriyagawa, T
机构
[1] Kitami Inst Technol, Dept Mech Engn, Kitami, Hokkaido 0908507, Japan
[2] Tohoku Univ, Dept Mechatron & Precis Engn, Aoba Ku, Sendai, Miyagi 9808579, Japan
来源
ADVANCES IN ABRASIVE TECHNOLOGY V | 2003年 / 238-2卷
关键词
Ductile machining; brittle material; aspheric surface; optics; silicon; diamond turning; ultra-precision cutting;
D O I
10.4028/www.scientific.net/KEM.238-239.43
中图分类号
TQ174 [陶瓷工业]; TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
A ductile machining system based on the straight-line enveloping method is developed for fabricating convex axisymmetric aspheric surfaces on hard brittle materials. This system enables thinning of undeformed chip thickness in the nanometric range by using a straight-nosed diamond tool on an X-Z-B 3-axis ultraprecision machine tool, capable for simultaneous numerical control. The configuration of the system and the cutting tests for a large-scale single-crystal silicon aspheric lens are described. The results indicate that the developed system improves production efficiency and tool life significantly, compared to the conventional method.
引用
收藏
页码:43 / 48
页数:6
相关论文
共 9 条
[1]   DUCTILE-REGIME MACHINING MODEL FOR DIAMOND TURNING OF BRITTLE MATERIALS [J].
BLACKLEY, WS ;
SCATTERGOOD, RO .
PRECISION ENGINEERING-JOURNAL OF THE AMERICAN SOCIETY FOR PRECISION ENGINEERING, 1991, 13 (02) :95-103
[2]   An investigation of residual form error compensation in the ultra-precision machining of aspheric surfaces [J].
Lee, WB ;
Cheung, CF ;
Chiu, WM ;
Leung, TP .
JOURNAL OF MATERIALS PROCESSING TECHNOLOGY, 2000, 99 (1-3) :129-134
[3]   Diamond turning of silicon substrates in ductile-regime [J].
Leung, TP ;
Lee, WB ;
Lu, XM .
JOURNAL OF MATERIALS PROCESSING TECHNOLOGY, 1998, 73 (1-3) :42-48
[4]  
NAKAMURA H, 1990, Japanese Journal of Ornithology, V39, P1, DOI 10.3838/jjo.39.1
[5]  
SUZUKI H, 1999, J JAP SOC PREC ENG, V63, P401
[6]  
Syn CK, 1998, PROCEEDINGS OF: SILICON MACHINING, P44
[7]   On the ductile machining of silicon for micro electro-mechanical systems (MEMS), opto-electronic and optical applications [J].
Yan, J ;
Yoshino, M ;
Kuriagawa, T ;
Shirakashi, T ;
Syoji, K ;
Komanduri, R .
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2001, 297 (1-2) :230-234
[8]  
Yan Jiwang, 1998, J JSPE, V64, P1345
[9]   Ductile regime turning at large tool feed [J].
Yan, JW ;
Syoji, K ;
Kuriyagawa, T ;
Suzuki, H .
JOURNAL OF MATERIALS PROCESSING TECHNOLOGY, 2002, 121 (2-3) :363-372