Development of a novel Ductile-machining system for fabricating axisymmetric aspheric surfaces on brittle materials

被引:6
作者
Yan, J
Tamaki, J
Syoji, K
Kuriyagawa, T
机构
[1] Kitami Inst Technol, Dept Mech Engn, Kitami, Hokkaido 0908507, Japan
[2] Tohoku Univ, Dept Mechatron & Precis Engn, Aoba Ku, Sendai, Miyagi 9808579, Japan
来源
ADVANCES IN ABRASIVE TECHNOLOGY V | 2003年 / 238-2卷
关键词
Ductile machining; brittle material; aspheric surface; optics; silicon; diamond turning; ultra-precision cutting;
D O I
10.4028/www.scientific.net/KEM.238-239.43
中图分类号
TQ174 [陶瓷工业]; TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
A ductile machining system based on the straight-line enveloping method is developed for fabricating convex axisymmetric aspheric surfaces on hard brittle materials. This system enables thinning of undeformed chip thickness in the nanometric range by using a straight-nosed diamond tool on an X-Z-B 3-axis ultraprecision machine tool, capable for simultaneous numerical control. The configuration of the system and the cutting tests for a large-scale single-crystal silicon aspheric lens are described. The results indicate that the developed system improves production efficiency and tool life significantly, compared to the conventional method.
引用
收藏
页码:43 / 48
页数:6
相关论文
共 9 条
  • [1] DUCTILE-REGIME MACHINING MODEL FOR DIAMOND TURNING OF BRITTLE MATERIALS
    BLACKLEY, WS
    SCATTERGOOD, RO
    [J]. PRECISION ENGINEERING-JOURNAL OF THE AMERICAN SOCIETY FOR PRECISION ENGINEERING, 1991, 13 (02): : 95 - 103
  • [2] An investigation of residual form error compensation in the ultra-precision machining of aspheric surfaces
    Lee, WB
    Cheung, CF
    Chiu, WM
    Leung, TP
    [J]. JOURNAL OF MATERIALS PROCESSING TECHNOLOGY, 2000, 99 (1-3) : 129 - 134
  • [3] Diamond turning of silicon substrates in ductile-regime
    Leung, TP
    Lee, WB
    Lu, XM
    [J]. JOURNAL OF MATERIALS PROCESSING TECHNOLOGY, 1998, 73 (1-3) : 42 - 48
  • [4] NAKAMURA H, 1990, Japanese Journal of Ornithology, V39, P1, DOI 10.3838/jjo.39.1
  • [5] SUZUKI H, 1999, J JAP SOC PREC ENG, V63, P401
  • [6] Syn CK, 1998, PROCEEDINGS OF: SILICON MACHINING, P44
  • [7] On the ductile machining of silicon for micro electro-mechanical systems (MEMS), opto-electronic and optical applications
    Yan, J
    Yoshino, M
    Kuriagawa, T
    Shirakashi, T
    Syoji, K
    Komanduri, R
    [J]. MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2001, 297 (1-2): : 230 - 234
  • [8] Yan Jiwang, 1998, J JSPE, V64, P1345
  • [9] Ductile regime turning at large tool feed
    Yan, JW
    Syoji, K
    Kuriyagawa, T
    Suzuki, H
    [J]. JOURNAL OF MATERIALS PROCESSING TECHNOLOGY, 2002, 121 (2-3) : 363 - 372