Preparation and thermal properties of bismaleimide blends based on hydroxyphenyl maleimide

被引：12
作者：
Rao, BS [1 ]
Sireesha, R [1 ]
Pasala, AR [1 ]
机构：
[1] Indian Inst Chem Technol, Organ Coatings & Polymers Div, Hyderabad 500007, Andhra Pradesh, India
来源：
POLYMER INTERNATIONAL | 2005年 / 54卷 / 08期
关键词：
bismaleimide; epoxy resin; blends; thermal properties;
D O I：
10.1002/pi.1808
中图分类号：
O63 [高分子化学（高聚物）];
学科分类号：
070305 ; 080501 ; 081704 ;
摘要：
N-(4-hydroxyphenyl)maleimide was melt-blended with the glycidyl ether of bisphenol-A and various mole percentages of 4,4'-(diaminodiphenylsulfone) bismaleimide. The cure behaviour of the resins was evaluated by differential scanning calorimetry (DSC) and dynamic mechanical thermal analysis (DMTA). The blends showed distinct reductions in the onset of cure (TO) and peak exothermic (T-exo) temperatures. The blends cured at low temperatures exhibited glass transition temperatures (TgS) higher than the cure temperatures. The cured blends showed high moduli, glass transition temperatures in excess of 250 degrees C and good thermal stabilities up to 400 degrees C. (c) 2005 Society of Chemical Industry.
引用
收藏
页码：1103 / 1109
页数：7
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