Enhancement-mode Ga2O3 wrap-gate fin field-effect transistors on native (100) β-Ga2O3 substrate with high breakdown voltage

被引:314
作者
Chabak, Kelson D. [1 ,2 ]
Moser, Neil [3 ]
Green, Andrew J. [4 ]
Walker, Dennis E. [1 ]
Tetlak, Stephen E. [1 ]
Heller, Eric [5 ]
Crespo, Antonio [1 ]
Fitch, Robert [1 ]
McCandless, Jonathan P. [4 ]
Leedy, Kevin [1 ]
Baldini, Michele [6 ]
Wagner, Gunter [6 ]
Galazka, Zbigniew [6 ]
Li, Xiuling [2 ]
Jessen, Gregg [1 ]
机构
[1] Air Force Res Lab, Sensors Directorate, Wright Patterson AFB, OH 45433 USA
[2] Univ Illinois, Dept Elect & Comp Engn, Micro & Nanotechnol Lab, Urbana, IL 61801 USA
[3] George Mason Univ, Dept Elect & Comp Engn, Fairfax, VA 22030 USA
[4] Wyle Labs Inc, 4200 Colonel Glenn Hwy, Beavercreek, OH 45431 USA
[5] Air Force Res Lab, Mat & Mfg Directorate, Wright Patterson AFB, OH 45433 USA
[6] Leibniz Inst Kristallzuchtung, Max Born Str 2, D-12489 Berlin, Germany
基金
美国国家科学基金会;
关键词
DENSITY; LAYERS; POWER;
D O I
10.1063/1.4967931
中图分类号
O59 [应用物理学];
学科分类号
摘要
Sn-doped gallium oxide (Ga2O3) wrap-gate fin-array field-effect transistors (finFETs) were formed by top-down BCl3 plasma etching on a native semi-insulating Mg-doped (100) beta-Ga2O3 substrate. The fin channels have a triangular cross-section and are approximately 300 nm wide and 200 nm tall. FinFETs, with 20 nm Al2O3 gate dielectric and similar to 2 mu m wrap-gate, demonstrate normally-off operation with a threshold voltage between 0 and +1V during high-voltage operation. The I-ON/I-OFF ratio is greater than 10(5) and is mainly limited by high on-resistance that can be significantly improved. At V-G = 0, a finFET with 21 mu m gate-drain spacing achieved a three-terminal breakdown voltage exceeding 600V without a field-plate. (C) 2016 Author(s).
引用
收藏
页数:5
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