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- [2] Self-heating impact on TDDB in bulk FinFET devices: Uniform vs Non-uniform Stress 2016 IEEE INTERNATIONAL INTEGRATED RELIABILITY WORKSHOP (IIRW), 2016, : 45 - 48
- [3] Impact of the channel shape, back oxide and gate oxide layers on self-heating in nanoscale JL FINFET NANOSYSTEMS-PHYSICS CHEMISTRY MATHEMATICS, 2022, 13 (02): : 148 - 155
- [5] Role of Material Gate Engineering in Improving Gate All Around Junctionless (GAAJL) MOSFET Reliability Against Hot-Carrier Effects 2020 32ND INTERNATIONAL CONFERENCE ON MICROELECTRONICS (ICM), 2020, : 194 - 197