Influence of furnace design on the thermal stress during directional solidification of multicrystalline silicon

被引:57
作者
Fang, H. S. [1 ]
Wang, S. [1 ]
Zhou, L. [2 ]
Zhou, N. G. [2 ]
Lin, M. H. [2 ]
机构
[1] Huazhong Univ Sci & Technol, Sch Energy & Power Engn, Wuhan 430074, Peoples R China
[2] Nanchang Univ, Sch Photovolta Engn, Nanchang 330031, Peoples R China
基金
中国国家自然科学基金;
关键词
Defects; Stresses; Growth from melt; Semiconducting silicon; Solar cells; INDUCED DISLOCATION GENERATION; BULK SINGLE-CRYSTAL; GROWTH; INGOT; MODEL; GAAS;
D O I
10.1016/j.jcrysgro.2012.02.032
中图分类号
O7 [晶体学];
学科分类号
0702 ; 070205 ; 0703 ; 080501 ;
摘要
Directional solidification is one of the most popular techniques for massive production of multicrystalline silicon (mc-Si). Dislocation is one of the major defects that significantly affect the photovoltaic performance. For the analysis and optimization of stress-induced dislocation, a computational tool has been developed to investigate thermal stress distribution during directional solidification process of multicrystalline silicon. Temperature distribution in the furnace, S/L interface shape and melt flow are simulated. Parametric studies are further conducted to evaluate the effect of furnace design on the interface shape and on the maximum von Mises stress in the growing ingot. To consider the effects of the crucible geometry qualitatively, three-dimensional modeling of the thermal stress is performed with or without the constraint of the crucible. The regions of dislocation multiplication are evaluated by comparing von Mises stress to critical resolved shear stress (CRSS). The results imply that the dislocation in the growing ingot can be reduced by optimizing the design of the directional solidification furnace. (C) 2012 Elsevier B.V. All rights reserved.
引用
收藏
页码:5 / 11
页数:7
相关论文
共 17 条
[1]  
[Anonymous], 2010, 2010 ANN WORLD SOL P
[2]  
Arafune K., 2006, PHYSICA B, V236, P376
[3]   Study on thermal stress in a silicon ingot during a unidirectional solidification process [J].
Chen, X. J. ;
Nakano, S. ;
Liu, L. J. ;
Kakimoto, K. .
JOURNAL OF CRYSTAL GROWTH, 2008, 310 (19) :4330-4335
[4]   Three-dimensional global analysis of thermal stress and dislocations in a silicon ingot during a unidirectional solidification process with a square crucible [J].
Chen, Xuejiang ;
Nakano, Satoshi ;
Kakimoto, Koichi .
JOURNAL OF CRYSTAL GROWTH, 2010, 312 (22) :3261-3266
[5]   GLOBAL MODELING OF HEAT-TRANSFER IN CRYSTAL-GROWTH FURNACES [J].
DUPRET, F ;
NICODEME, P ;
RYCKMANS, Y ;
WOUTERS, P ;
CROCHET, MJ .
INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER, 1990, 33 (09) :1849-1871
[6]   Finite volume multigrid solver for thermo-elastic stress analysis in anisotropic materials [J].
Fainberg, J ;
Leister, HJ .
COMPUTER METHODS IN APPLIED MECHANICS AND ENGINEERING, 1996, 137 (02) :167-174
[7]   Numerical Study of the Micro-Pulling-Down Process for Sapphire Fiber Crystal Growth [J].
Fang, H. S. ;
Yan, Z. W. ;
Bourret-Courchesne, E. D. .
CRYSTAL GROWTH & DESIGN, 2011, 11 (01) :121-129
[8]   Reducing melt inclusion by submerged heater or baffle for optical crystal growth [J].
Fang, Haisheng ;
Zheng, Lili ;
Zhang, Hui ;
Hong, Yong ;
Deng, Qun .
CRYSTAL GROWTH & DESIGN, 2008, 8 (06) :1840-1848
[9]   A COMPARATIVE-STUDY OF THERMAL-STRESS INDUCED DISLOCATION GENERATION IN PULLED GAAS, INP, AND SI CRYSTALS [J].
JORDAN, AS ;
CARUSO, R ;
VONNEIDA, AR ;
NIELSEN, JW .
JOURNAL OF APPLIED PHYSICS, 1981, 52 (05) :3331-3336
[10]   Thermal system design and optimization of an industrial silicon directional solidification system [J].
Ma, Xu ;
Zheng, Lili ;
Zhang, Hui ;
Zhao, Bo ;
Wang, Cheng ;
Xu, Fenghua .
JOURNAL OF CRYSTAL GROWTH, 2011, 318 (01) :288-292