Distribution of deep-level traps at atomic-layer-deposited Al2O3/n-GaN interface

被引:10
作者
Yan, Dawei [1 ,3 ]
Lu, Hai [1 ]
Chen, Dunjun [1 ]
Zhang, Rong [1 ]
Zheng, Youdou [1 ]
Qian, Xu [2 ]
Li, Aidong [2 ]
机构
[1] Nanjing Univ, Sch Elect Sci & Engn, Nanjing 210093, Jiangsu, Peoples R China
[2] Nanjing Univ, Dept Mat Sci & Engn, Nanjing 210093, Jiangsu, Peoples R China
[3] Jiangnan Univ, Sch Informat Technol, Wuxi 214122, Peoples R China
基金
中国国家自然科学基金;
关键词
Interface traps; Al2O3/GaN; Photo-assisted CV; CURRENT COLLAPSE;
D O I
10.1016/j.sse.2012.02.012
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The distribution of deep-level traps at atomic-layer-deposited Al2O3/n-GaN interface is studied by photo-assisted high-frequency capacitance-voltage (C-V) method. The dark C-V curve of the fabricated metal-oxide-semiconductor (MOS) capacitors shows positive-shifted ideal MOS characteristics with deep-depletion behavior. The electrons trapped at deep states can be neutralized by holes generated by ultra-violet (UV) light illumination. An interface-trap-related voltage stretch-out of the C-V curve is then obtained by sweeping the capacitor from depletion back to accumulation after UV illumination, at which electrons gradually inject back into the emptied donor-like trap states. By comparing the voltage shift of the post-UV curve with an "ideal" trap-free C-V curve obtained by a parallel-shift of the dark C-V curve, a decayed interface trap profile towards the mid-bandgap is derived, yielding a peak value of similar to(1-2) x 10(12) eV(-1) cm(-2) at similar to 0.3 eV below the conduction band edge of GaN. (c) 2012 Elsevier Ltd. All rights reserved.
引用
收藏
页码:56 / 59
页数:4
相关论文
共 14 条
  • [1] SURFACE STATES AT STEAM-GROWN SILICON-SILICON DIOXIDE INTERFACES
    BERGLUND, CN
    [J]. IEEE TRANSACTIONS ON ELECTRON DEVICES, 1966, ED13 (10) : 701 - +
  • [2] Low interface trap density for remote plasma deposited SiO2 on n-type GaN
    Casey, HC
    Fountain, GG
    Alley, RG
    Keller, BP
    DenBaars, SP
    [J]. APPLIED PHYSICS LETTERS, 1996, 68 (13) : 1850 - 1852
  • [3] Mechanisms of current collapse and gate leakage currents in AlGaN/GaN heterostructure field effect transistors
    Hasegawa, H
    Inagaki, T
    Ootomo, S
    Hashizume, T
    [J]. JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 2003, 21 (04): : 1844 - 1855
  • [4] Suppression of current collapse in insulated gate AlGaN/GaN heterostructure field-effect transistors using ultrathin Al2O3 dielectric
    Hashizume, T
    Ootomo, S
    Hasegawa, H
    [J]. APPLIED PHYSICS LETTERS, 2003, 83 (14) : 2952 - 2954
  • [5] Border traps in Al2O3/In0.53Ga0.47As (100) gate stacks and their passivation by hydrogen anneals
    Kim, Eun Ji
    Wang, Lingquan
    Asbeck, Peter M.
    Saraswat, Krishna C.
    McIntyre, Paul C.
    [J]. APPLIED PHYSICS LETTERS, 2010, 96 (01)
  • [6] Metal-oxide-semiconductor devices using Ga2O3 dielectrics on n-type GaN
    Lee, CT
    Chen, HW
    Lee, HY
    [J]. APPLIED PHYSICS LETTERS, 2003, 82 (24) : 4304 - 4306
  • [7] Improved two-dimensional electron gas transport characteristics in AlGaN/GaN metal-insulator-semiconductor high electron mobility transistor with atomic layer-deposited Al2O3 as gate insulator
    Liu, Z. H.
    Ng, G. I.
    Arulkumaran, S.
    Maung, Y. K. T.
    Teo, K. L.
    Foo, S. C.
    Sahmuganathan, V.
    [J]. APPLIED PHYSICS LETTERS, 2009, 95 (22)
  • [8] Muller RS, 1982, DEVICE ELECT INTEGRA
  • [9] Temperature-dependent interface-state response in an Al2O3/n-GaN structure
    Ooyama, Kimihito
    Kato, Hiroki
    Miczek, Marcin
    Hashizume, Tamotsu
    [J]. JAPANESE JOURNAL OF APPLIED PHYSICS, 2008, 47 (07) : 5426 - 5428
  • [10] Schroder D. K., 2005, Semiconductor material and device characterization