A MEMS stage for 3-axis nanopositioning

被引:63
作者
Liu, Xinyu [1 ]
Kim, Keekyoung [1 ]
Sun, Yu [1 ]
机构
[1] Univ Toronto, Dept Mech & Ind Engn, Toronto, ON M5S 3G8, Canada
关键词
D O I
10.1088/0960-1317/17/9/007
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Applications in micro- and nanotechnologies require millimeter- sized devices that are capable of 3-axis positioning with motion ranges of micrometers and resolutions of nanometers. This paper reports on the design, fabrication and testing of a MEMS-based 3-axis positioning stage. In-plane ( comb-drive) and out-of-plane (parallel-plate) electrostatic actuators are employed for driving the stage to move independently along the XYZ directions, by +/- 12.5 mu m in the X and Y directions at an actuation voltage of 30 V and by 3.5 mu m in the Z direction at 14.8 V. The structures are designed to achieve highly decoupled motions by effectively suppressing cross-axis motion coupling. The open-loop positioning repeatability is determined to be better than 17.3 nm along all three axes.
引用
收藏
页码:1796 / 1802
页数:7
相关论文
共 29 条
[1]   Development of three-dimensional electrostatic stages for scanning probe microscope [J].
Ando, Y .
SENSORS AND ACTUATORS A-PHYSICAL, 2004, 114 (2-3) :285-291
[2]  
BERGNA S, 2005, 2005 ASME INT MECH E, P1
[3]   Electromagnetically actuated mirror arrays for use in 3-D optical switching applications [J].
Bernstein, JJ ;
Taylor, WP ;
Brazzle, JD ;
Corcoran, CJ ;
Kirkos, G ;
Odhner, JE ;
Pareek, A ;
Waelti, M ;
Zai, M .
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, 2004, 13 (03) :526-535
[4]   Vibration compensation for high speed scanning tunneling microscopy [J].
Croft, D ;
Devasia, S .
REVIEW OF SCIENTIFIC INSTRUMENTS, 1999, 70 (12) :4600-4605
[5]  
FAN L, 1997, P INT C SOL STAT SEN, P319
[6]  
Gere J.M., 2004, Mechanics of Materials, V6th
[7]   Single-wafer-processed nano-positioning XY-stages with trench-sidewall micromachining technology [J].
Gu, Lei ;
Li, Xinxin ;
Bao, Haifei ;
Liu, Bin ;
Wang, Yuelin ;
Liu, Min ;
Yang, Zunxian ;
Cheng, Baoluo .
JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 2006, 16 (07) :1349-1357
[8]  
Jaecklin V. P., 1992, Proceedings. IEEE Micro Electro Mechanical Systems. An Investigation of Micro Structures, Sensors, Actuators, Machines and Robots(Cat. No.92CH3093-2), P147, DOI 10.1109/MEMSYS.1992.187707
[9]   Design, modeling, fabrication and testing of a high aspect ratio electrostatic torsional MEMS micromirror [J].
Joudrey, Kurt ;
Adams, George G. ;
McGruer, Nicol E. .
JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 2006, 16 (10) :2147-2156
[10]   Silicon micro XY-stage with a large area shuttle and no-etching holes for SPM-based data storage [J].
Kim, CH ;
Jeong, HM ;
Jeon, JU ;
Kim, YK .
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, 2003, 12 (04) :470-478