The influence of nanoscale morphology on the resistivity of cluster-assembled nanostructured metallic thin films

被引：30
作者：
Barborini, E. [1 ]
Corbelli, G. [2 ,3 ]
Bertolini, G. [1 ]
Repetto, P. [1 ]
Leccardi, M. [1 ]
Vinati, S.
Milani, P. [2 ,3 ]
机构：
[1] Tethis srl, I-20143 Milan, Italy
[2] Univ Milan, CIMAINA, I-20133 Milan, Italy
[3] Univ Milan, Dipartimento Fis, I-20133 Milan, Italy
来源：
NEW JOURNAL OF PHYSICS | 2010年 / 12卷
关键词：
SURFACE-ROUGHNESS; ELECTRICAL-RESISTIVITY; CONDUCTION; PERCOLATION; BEAMS; MODEL;
D O I：
10.1088/1367-2630/12/7/073001
中图分类号：
O4 [物理学];
学科分类号：
0702 ;
摘要：
We have studied in situ the evolution of the electrical resistivity of Fe, Pd, Nb, Wand Mo cluster-assembled films during their growth by supersonic cluster beam deposition. We observed resistivity of cluster-assembled films several orders of magnitude larger than the bulk, as well as an increase in resistivity by increasing the film thickness in contrast to what was observed for atom-assembled metallic films. This suggests that the nanoscale morphological features typical of ballistic films growth, such as the minimal cluster-cluster interconnection and the evolution of surface roughness with thickness, are responsible for the observed behaviour.
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页数：12
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