Deformation analysis of lap-shear testing of solder joints

被引：73

作者：

Shen, YL ^{[1
]}

Chawla, N

Ege, ES

Deng, X

机构：

[1] Univ New Mexico, Dept Mech Engn, Albuquerque, NM 87131 USA

[2] Arizona State Univ, Dept Chem & Mat Engn, Ira A Fulton Sch Engn, Tempe, AZ 85287 USA

来源：

ACTA MATERIALIA | 2005年 / 53卷 / 09期

基金：

美国国家科学基金会;

关键词：

mechanical properties; finite element analysis; solder; lap-shear testing;

D O I：

10.1016/j.actamat.2005.02.024

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

A combined numerical and experimental study of lap-shear testing of solder joints was carried out. The primary objective was to provide a quantitative evaluation of shear deformation experienced by the solder. The numerical analysis was based on finite element modeling of deformation in the substrate-solder assembly. The calculated shear response, utilizing both the commonly adopted far-field measurements and the actual shear strain in solder, was found to differ significantly. The geometric and material parameters during lap shear were explored to provide physical insight into the problem. The nature of deformation of the substrate was seen to greatly influence the shear behavior of the solder. The "transmission" of shear strain into the solder is very ineffective when the solder is in the elastic state, resulting in smaller shear strains in the solder than the nominal values. This effect is also true even when the solder is deforming plastically. Experimental measurements of solder shear using direct optical measurements confirmed the numerical findings. Subtraction of the average deformation of the Cu substrate provides a reasonable, albeit not complete, approximation of the solder strain. (c) 2005 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.

引用

页码：2633 / 2642

页数：10

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