A G-Band Broadband Balanced Power Amplifier Module Based on Cascode mHEMTs

被引:10
作者
Amado-Rey, B. [1 ]
Campos-Roca, Y. [2 ]
Friesicke, C. [3 ]
van Raay, E. [3 ]
Massler, H. [3 ]
Leuther, A. [3 ]
Ambacher, O. [3 ]
机构
[1] Albert Ludwigs Univ Freiburg, Inst Microsyst Tech, D-79110 Freiburg, Germany
[2] Univ Extremadura, Dept Comp & Commun Technol, Caceres 10003, Spain
[3] Fraunhofer IAF, D-79108 Freiburg, Germany
关键词
Balanced power amplifier; G-band; grounded coplanar waveguide (GCPW); module; monolithic millimeter-wave integrated circuit (MMIC); WR-5;
D O I
10.1109/LMWC.2018.2862646
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The first full G-band power amplifier module demonstrated in GaAs metamorphic high electron mobility transistor (mHEMT) technology has been developed for use as a driver amplifier in instrumentation. The circuit integrated in this module uses a compact balanced cascode topology and is based on a 35-nm mHEMT technology in a grounded coplanar waveguide environment. High compactness is achieved due to the use of a small ground-to-ground spacing of 14 mu m and an advanced process with three metallization layers. The millimeter-wave integrated circuit exhibits a linear gain higher than 15.3 dB and return losses better than 10 dB from 118 to 236 GHz, which represents an ultrabroad relative bandwidth (RBW) of 67%. A peak output power of 10 dBm is achieved at 200 GHz. The WR-5 module uses broadband transitions, which show insertion losses of less than 1.5 dB. It demonstrates a small-signal gain that exceeds 13.4 dB in the whole G-band (RBW >= 54%). Large-signal characterization exhibits power levels higher than 3.6 dBm from 130 to 210 GHz (RBW = 47%). This module achieves the highest bandwidth in G-band and the highest output power when comparing it with modules based on similar technologies.
引用
收藏
页码:924 / 926
页数:3
相关论文
共 6 条
[1]  
[Anonymous], 2011, PROC IEEE COMPOUND S
[2]   A 200 GHz Monolithic Integrated Power Amplifier in Metamorphic HEMT Technology [J].
Kallfass, I. ;
Pahl, P. ;
Massler, H. ;
Leuther, A. ;
Tessmann, A. ;
Koch, S. ;
Zwick, T. .
IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, 2009, 19 (06) :410-412
[3]   A PolyStrata 820 mW G-band Solid State Power Amplifier [J].
Rollin, Jean-Marc ;
Miller, David ;
Urteaga, Miguel ;
Griffith, Zachary M. ;
Kazemi, Hooman .
2015 IEEE COMPOUND SEMICONDUCTOR INTEGRATED CIRCUIT SYMPOSIUM (CSICS), 2015,
[4]   A Broadband 220-320 GHz Medium Power Amplifier Module [J].
Tessmann, A. ;
Leuther, A. ;
Hurm, V. ;
Massler, H. ;
Wagner, S. ;
Kuri, M. ;
Zink, M. ;
Riessle, M. ;
Stulz, H. -P. ;
Schlechtweg, M. ;
Ambacher, O. .
2014 IEEE COMPOUND SEMICONDUCTOR INTEGRATED CIRCUIT SYMPOSIUM (CSICS): INTEGRATED CIRCUITS IN GAAS, INP, SIGE, GAN AND OTHER COMPOUND SEMICONDUCTORS, 2014,
[5]   Metamorphic HEMT MMICs and Modules for Use in a High-Bandwidth 210 GHz Radar [J].
Tessmann, Axel ;
Kallfass, Ingmar ;
Leuther, Arnulf ;
Massler, Hermann ;
Kuri, Michael ;
Riessle, Markus ;
Zink, Martin ;
Sommer, Rainer ;
Wahlen, Alfred ;
Essen, Helmut ;
Hurm, Volker ;
Schlechtweg, Michael ;
Ambacher, Oliver .
IEEE JOURNAL OF SOLID-STATE CIRCUITS, 2008, 43 (10) :2194-2205
[6]   600 GHz Resistive Mixer S-MMICs with Integrated Multiplier-by-Six in 35 nm mHEMT Technology [J].
Weber, Rainer ;
Tessmann, Axel ;
Massler, Hermann ;
Leuther, Arnulf ;
Lewark, Ulrich J. .
2016 11TH EUROPEAN MICROWAVE INTEGRATED CIRCUITS CONFERENCE (EUMIC), 2016, :85-88