Fabrication and thermal conductivity of near-net-shaped diamond/copper composites by pressureless infiltration

被引：26

作者：

Dong, Ying-Hu ^{[1
,2
]}

He, Xin-Bo ^{[1
]}

Rafi-ud-din ^{[1
,3
]}

Xu, Liang ^{[1
]}

Qu, Xuan-Hui ^{[1
]}

机构：

[1] Univ Sci & Technol Beijing, Sch Mat Sci & Engn, Beijing 100083, Peoples R China

[2] Nanchang Hangkong Univ, Sch Mat Sci & Engn, Nanchang 330063, Peoples R China

[3] Pakistan Inst Nucl Sci & Technol, Div Chem, Islamabad, Pakistan

来源：

JOURNAL OF MATERIALS SCIENCE | 2011年 / 46卷 / 11期

关键词：

Thermal Conductivity; High Pure; Diamond Particle; Liquid Copper; Protective Atmosphere;

D O I：

10.1007/s10853-011-5307-0

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Near-net-shaped diamond/copper composites with a relative density of over 99% and thermal conductivity of over 350 Wm(-1) K-1 are successfully fabricated by powder press-pressureless infiltration processing. The effects of infiltration temperature, infiltration time, interfacial thickness, and type of protective atmosphere on the thermal conductivity of the diamond/copper composites were investigated. The results showed that the diamond-copper composites with complicated shape exhibited better thermal properties, which can be widely used in electronic packaging field. It was found that the properties of diamond-copper composites infiltrated in high vacuum atmosphere were better than that of composites infiltrated in other atmospheres. The thickness of interface showed great effects on the properties of composites. The carbide interfaces were attributed to the decrease of interfacial thermal resistance and enhancement of wetting properties between the diamonds and copper.

引用

页码：3862 / 3867

页数：6

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