One-Step Fabrication of Al/Sn-Bi Core-Shell Spheres via Phase Separation

被引：30

作者：

Dai, R. ^{[1
]}

Zhang, S. G. ^{[1
]}

Li, J. G. ^{[1
]}

机构：

[1] Shanghai Jiao Tong Univ, Sch Mat Sci & Engn, Shanghai 200240, Peoples R China

来源：

JOURNAL OF ELECTRONIC MATERIALS | 2011年 / 40卷 / 12期

关键词：

Core-shell; Al-Bi-Sn; Phase separation; Soldering; ALLOY POWDERS; MICROSTRUCTURE;

D O I：

10.1007/s11664-011-1779-6

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Al/Sn-Bi core-shell spheres, which have potential for use in advanced electronic packaging, were fabricated in one step via phase separation by spraying liquid (Al0.345Bi0.655)(67.8)Sn-32.2 alloy into silicone oil. The core-shell spheres changed morphology from three-layer to concentric or eccentric dual-layer type with decreasing melt superheat and increasing oil temperature. The spheres are Al-rich in the core, covered with a Sn-Bi-rich periphery, showing a two-stage melting behavior suitable for electronic packaging. The (Al0.345Bi0.655)(67.8)Sn-32.2 alloy was identified through thermal analysis to undergo liquid-phase separation, monotectic reaction, and eutectic reaction one after another during cooling. Finally, the solidification path of (Al0.345Bi0.655)(67.8)Sn-32.2 alloy was analyzed and was schematically illustrated.

引用

页码：2458 / 2464

页数：7

共 24 条

[1] Progress toward gas atomization processing with increased uniformity and control [J].

Anderson, IE ;

Terpstra, RL .

MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2002, 326 (01) :101-109

[2] Behaviour of bismuth during simulated processing of model aluminium capacitor foils [J].

Ashitaka, Z ;

Thompson, GE ;

Skeldon, P ;

Habazaki, H ;

Shimizu, K .

JOURNAL OF MATERIALS SCIENCE, 2001, 36 (09) :2237-2243

[3]

Brown W.D., 1999, ADV ELECT PACKAGING

[4] Low-frequency damping properties of eutectic Sn-Bi and In-Sn solders [J].

Chang, S. H. ;

Wu, S. K. .

SCRIPTA MATERIALIA, 2011, 64 (08) :757-760

[5] Interfacial reactions and mechanical properties of ball-grid-array solder joints using Cu-cored solder balls [J].

Chen, Chih-Ming ;

Lin, Huei-Chuan .

JOURNAL OF ELECTRONIC MATERIALS, 2006, 35 (11) :1937-1947

[6] Phase separation and formation of core-type microstructure of Al-65.5 mass% Bi immiscible alloys [J].

Dai, R. ;

Zhang, S. G. ;

Li, Y. B. ;

Guo, X. ;

Li, J. G. .

JOURNAL OF ALLOYS AND COMPOUNDS, 2011, 509 (05) :2289-2293

[7] Formation of core-type microstructure in Al-Bi monotectic alloys [J].

Dai, Rongrong ;

Zhang, Shuguang ;

Guo, Xiang ;

Li, Jianguo .

MATERIALS LETTERS, 2011, 65 (02) :322-325

[8] Phase transformations in ternary monotectic aluminum alloys [J].

Gröbner, J ;

Schmid-Fetzer, R .

JOM, 2005, 57 (09) :19-23

[9] Monotectic four-phase reaction in Al-Bi-Zn alloys [J].

Gröbner, J ;

Mirkovic, D ;

Schmid-Fetzer, R .

ACTA MATERIALIA, 2005, 53 (11) :3271-3280

[10] Diffusion during phase separation [J].

Jackson, Kenneth A. .

JOURNAL OF NON-CRYSTALLINE SOLIDS, 2010, 356 (23-24) :1109-1130

← 1 2 3 →