Multilayer organic multichip module implementing hybrid microelectromechanical systems

被引：7

作者：

Chen, Morgan Jikang ^{[1
,2
]}

Pham, Anh-Vu ^{[2
]}

Evers, Nicole ^{[3
]}

Kapusta, Chris ^{[3
]}

Iannotti, Joseph ^{[3
]}

Kornrumpf, William ^{[3
]}

Maciel, John ^{[4
]}

机构：

[1] Endwave Corp, San Jose, CA 94085 USA

[2] Univ Calif Davis, Dept Elect & Comp Engn, Microwave Microsyst Lab, Davis, CA 95616 USA

[3] Gen Elect Global Res Ctr, Niskayuna, NY 12309 USA

[4] Radant MEMS Inc, Stow, MA 01775 USA

来源：

IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES | 2008年 / 56卷 / 04期

基金：

美国国家科学基金会;

关键词：

cavities; chip-on-flex; liquid-crystal polymer (LCP); microelectromechanical systems (MEMS); microwave; packaging; phase shifter;

D O I：

10.1109/TMTT.2008.919642

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

We present the design and development of an organic package that is compatible with fully released RF microelectromechanical systems (MEMS). The multilayer organic package consists of a liquid-crystal polymer film to provide near hermetic cavities for MEMS. The stack is further built up using organic thin-film polyimide. To demonstrate the organic package, we have designed and implemented a 2-bit true-time delay X-band phase shifter using commercially available microelectromechanical switches. The packaged phase shifter has a measured insertion loss of 2.45 ± 0.12 dB/bit at 10 GHz. The worst case phase variation of the phase shifter at 10 GHz is measured to less than 5°. We have also conducted temperature cycling -65 °C to 150 °C and 85/85 to qualify the packaging structures. © 2006 IEEE.

引用

页码：952 / 958

页数：7

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