Lateral buckling and mechanical stretchability of fractal interconnects partially bonded onto an elastomeric substrate

被引:45
作者
Fu, Haoran [1 ,2 ,3 ]
Xu, Sheng [4 ]
Xu, Renxiao [2 ,3 ]
Jiang, Jianqun [1 ]
Zhang, Yihui [2 ,3 ,5 ]
Rogers, John A. [4 ]
Huang, Yonggang [2 ,3 ]
机构
[1] Zhejiang Univ, Dept Civil Engn & Architecture, Hangzhou 310058, Zhejiang, Peoples R China
[2] Northwestern Univ, Skin Dis Res Ctr, Ctr Engn & Hlth, Dept Civil & Environm Engn, Evanston, IL 60208 USA
[3] Northwestern Univ, Skin Dis Res Ctr, Ctr Engn & Hlth, Dept Mech Engn, Evanston, IL 60208 USA
[4] Univ Illinois, Frederick Seitz Mat Res Lab, Dept Mat Sci & Engn, Urbana, IL 61801 USA
[5] Tsinghua Univ, Ctr Mech & Mat, Beijing 100084, Peoples R China
基金
美国国家科学基金会;
关键词
THIN-FILMS; SERPENTINE MICROSTRUCTURES; ELECTRONIC SKIN; SILICON; DESIGNS; DEVICES; TRANSISTORS; CIRCUITS; SENSORS; MATRIX;
D O I
10.1063/1.4913848
中图分类号
O59 [应用物理学];
学科分类号
摘要
Fractal-inspired designs for interconnects that join rigid, functional devices can ensure mechanical integrity in stretchable electronic systems under extreme deformations. The bonding configuration of such interconnects with the elastomer substrate is crucial to the resulting deformation modes, and therefore the stretchability of the entire system. In this study, both theoretical and experimental analyses are performed for postbuckling of fractal serpentine interconnects partially bonded to the substrate. The deformation behaviors and the elastic stretchability of such systems are systematically explored, and compared to counterparts that are not bonded at all to the substrate. (C) 2015 AIP Publishing LLC.
引用
收藏
页数:5
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