Study the Effect of Temperature on the Diffusion Bonding of Cu-Al by Using Molecular Dynamics Simulation

The aim of this study is to investigate the effect of applied temperature on the diffusion behavior between Cu and Al by using molecular dynamics (MD) simulation. Simulation results have indicated that diffusion of Cu atoms into Al side dominantly promote diffusion mechanism, while diffusion from Al atoms to Cu side show less dominant. In addition, the thickness of the interfacial region is dependent on the temperature where it increases with increasing of temperature. Good bonding structure is achieved at high temperature is increased as proofed by the concentration distribution profiles. At the same time, the high temperature decreases the ultimate tensile strength. However, the decrease of ultimate tensile strength is significant when the temperature increases to 800 K. The optimum conditions of diffusion bonding between Cu and Al are achieved when the temperature is set at 750 K, since it shows excellent bonding structure while it also have excellent ultimate tensile strength.