Modeling and Analysis of the Dynamic Behavior for Interacting Cracks on Circular Cavities in Piezoelectric Material

被引：0
作者：
Li, Dong [1 ]
Wang, Hui-Cong [1 ]
机构：
[1] Hebei Jiaotong Vocat & Tech Coll, Dept Civil Engn, Shijiazhuang 050091, Peoples R China
来源：
PROCEEDINGS OF THE 2015 INTERNATIONAL CONFERENCE ON MATERIAL SCIENCE AND APPLICATIONS (ICMSA 2015) | 2015年 / 3卷
关键词：
Radial Crack; Piezoelectric Material; Green's Function; Dynamic Stress Intensity Factor (DSIF); SH-wave; INTERFACIAL CRACKS;
D O I：
暂无
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
The present paper is exposed theoretically to the influence on the dynamic stress intensity factor (DSIF) in the piezoelectric material model with two permeable radial cracks emanating from the edges of two circular cavities, subjected to the dynamic incident anti-plane shearing wave (SH-wave). Green's functions are established based on complex variable and wave function expansion methods. Conjunction and crack-simulation techniques are used to evaluate DSIFs at the cracks' tip. The problem is reduced to a series of Fredholm integral equations of first kind. The numerical results are obtained by solving the equations to show the influence of the structural geometry, and the wave frequencies of incident wave on the dimensionless DSIFs.
引用
收藏
页码：432 / 437
页数：6
相关论文
共 31 条
1234